Patents by Inventor Osamu WATANUKI

Osamu WATANUKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic module and method for manufacturing same
    Patent number: 11049780
    Abstract: An electronic module includes a substrate having flexibility and an electrical insulation property, a circuit unit in which an electronic device is mounted on a wiring pattern formed on at least any one of surfaces of the substrate, and a resin body in which the circuit unit is sealed with an electrical insulating resin, wherein the substrate has flexibility to be deformable due to a pressure during sealing with the electrical insulating resin.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: June 29, 2021
    Assignee: TATEYAMA KAGAKU CO., LTD.
    Inventors: Osamu Watanuki, Kenichi Honda, Orie Shinohara, Akira Ishikawa, Tsutomu Ishikawa
  • ELECTRONIC MODULE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20200135598
    Abstract: An electronic module includes a substrate having flexibility and an electrical insulation property, a circuit unit in which an electronic device is mounted on a wiring pattern formed on at least any one of surfaces of the substrate, and a resin body in which the circuit unit is sealed with an electrical insulating resin, wherein the substrate has flexibility to be deformable due to a pressure during sealing with the electrical insulating resin.
    Type: Application
    Filed: April 17, 2018
    Publication date: April 30, 2020
    Applicant: TATEYAMA KAGAKU INDUSTRY CO., LTD.
    Inventors: Osamu WATANUKI, Kenichi HONDA, Orie SHINOHARA, Akira ISHIKAWA, Tsutomu ISHIKAWA