Abstract: A semiconductor device includes a metal substrate; a semiconductor element placed on the metal substrate; a flexible circuit substrate that has one end placed on the metal substrate and is electrically connected to the semiconductor element, the flexible circuit substrate extending over an edge of the metal substrate to outside the metal substrate; a resin wall portion placed, in an outer periphery of the metal substrate, at least at the edge of the metal substrate over which the flexible circuit substrate extends, the resin wall portion being provided on the flexible circuit substrate at the edge; and a resin seal portion provided inside the resin wall portion so as to cover the metal substrate.

Abstract: A semiconductor device includes a connection terminal. The connection terminal includes two legs bonded via a filler material to a bonding target object that is a substrate or one semiconductor element placed on the substrate; and a joining portion connected to the two legs, extending between the two legs, and separated from the bonding target object.

Abstract: In order to precisely detect positions of respective lead portions of an electronic component and to reduce the cost of production of the electronic component, the electronic component has a resinous pad portion and a plurality of terminal units embedded in the pad portion. Each of the terminal units is provided with lead portions that are disposed parallel to one another with their terminal faces exposed, and junction portions for junction between bonding wires and the lead portions are formed on the terminal faces. Corner portions are formed at predetermined sections on the terminal faces. In this case, even if resin of the pad portion has adhered to the peripheries of the terminal faces and fouled the terminal faces, since the lead portions have the corner portions, images of the lead portions can be detected precisely. Accordingly, the operation of connecting the bonding wires to the terminal faces is performed more efficiently, whereby the cost of production of the electronic component can be reduced.

Abstract: In an electronic control unit, a pad portion thereof is firmly fixed to a terminal plate and vibration of the terminal plate under supersonic vibration is prevented so as to secure the bonding strength between the terminal plate and the wire during wire bonding. One lead portion of each terminal plate is connected to a pin of the connector and another lead portion is wire bonded to the terminal of the circuit substrate. The leads have bent portions extending from an exposed surface to be bonded in opposite directions to be embedded in the pad portion of the case such that the lead portion of the terminal plate is firmly fixed to the case.

Abstract: In a local module (11(1)) of an asynchronous time division exchange or switching system, each of connection ports (17) transfers a transmission signal to a module bus (19) as a cell with its header made to indicate a destination module number and a destination port number as a VCI (Virtual channel identifier) when the signal is directed to a destination module (11(N)) and one of the connection ports, respectively. Preferably, a connection control unit (15) of the local module transfers and does not transfer the cell to a highway bus (13) when the signal is directed to the destination module and the last-mentioned one of the connection ports. More preferably, the header additionally indicates a binary one and zero bit when the signal is directed to the destination module and the last-mentioned one of the connection ports.

Abstract: A dielectric filter includes a unitary dielectric block formed of a uniform, single dielectric material and having electrically conductive metallized patterns formed on front, rear and lateral walls, and on an outer bottom surface thereof. A plurality of coaxial dielectric resonators each including an open end and a central conductor are longitudinally arranged along the center of a top surface of the block and are spaced apart a predetermined distance. Frequency adjusting patterns are formed on the top surface of the block, each frequency adjusting pattern extending around an open end of a respective one of the resonators. Coupling amount adjusting patterns are also disposed on the top surface of the block, each connected to the front and rear walls and disposed between adjacent ones of the frequency adjusting patterns. At least one additional coupling amount adjusting pattern is disposed on the top surface of the block.

Abstract: A dielectric block plating apparatus provides electrolytic solution to be circulated through a plating tank in a substantially uniform flow through practically the entire interior of the plating tank to form conductive layers over predetermined areas of ground conductive layers formed on surfaces of a dielectric block having through holes extending from the top surface to the bottom surface thereof. The dielectric block is immersed and held in the electrolytic solution contained in the plating tank so that the respective center axes of the through holes of the dielectric block extend parallel to the direction of flow of the electrolytic solution.

Abstract: In a dielectric block plating process an electrolytic solution is circulated through a plating tank in a substantially uniform flow through practically the entire interior of the plating tank to form conductive layers over predetermined arears of ground conductive layers formed on surfaces of a dielectric block having through holes extending from the top surface to the bottom surface thereof. The dielectric block is immersed and held in the electrolytic solution contained in the plating tank so that the respective center axes of the through holes of the dielectric block extend parallel to the direction of flow of the electrolytic solution.

Abstract: A dielectric filter and a method of manufacture. The filter includes a block of ceramic material having one or more holes extending from a top surface to a bottom surface, each of which is interiorly covered with conductive material so as to form an inner conductive layer. The bottom surface and side surfaces of the block are also covered with bottom and side conductive layers electrically connected to the inner conductive layers at the bottom surface. The inner conductive layer is further connected to spaced apart top conductive layer portions provided on the top surface of the block surrounding each hole. The top layer portions are spaced from each other and have an oblique edge portion which is capacitively coupled with, and obliquely faces an upper edge portion of the side conductive layers, the oblique edge facilitating adjustment of the resonant frequency by removal of a predetermined amount of conductive material therefrom.

Abstract: A dielectric filter of which a characteristic is stable without a gastight casing. The dielectric filter's structure is comprised of an input, an output, a dielectric having a plurality of holes extending from a top to a bottom surface thereof, each of the holes being covered with a first conductive material, a second conductive material being electrically connected to the first conductive material at the bottom surface and unconnected to the first conductive material at the top surface, and an insulating weatherproof coating provided on the top surface.