Patents by Inventor Osamu Yatabe

Osamu Yatabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8309164
    Abstract: A metallized substrate having, disposed in the order mentioned: a ceramics substrate; a high-melting point metal layer; a base nickel plating layer; a layered nickel-phosphorous plating layer; a diffusion-inhibiting plating layer; and a gold plating layer. The base nickel plating layer being any one of a nickel plating layer, a nickel-boron plating layer, or a nickel-cobalt plating layer. The diffusion-inhibiting plating layer being any one of a columnar nickel-phosphorous plating layer, a palladium-phosphorous plating layer, or a palladium plating layer. According to the above composition, even after heating the semiconductor chips in a mounted state, the metallized substrate can make the connection strength of wire bonding favorable.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: November 13, 2012
    Assignee: Tokuyama Corporation
    Inventors: Tetsuo Imai, Osamu Yatabe, Masakatsu Maeda
  • Patent number: 8071187
    Abstract: A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: December 6, 2011
    Assignee: Tokuyama Corporation
    Inventors: Yasuyuki Yamamoto, Osamu Yatabe, Masakatsu Maeda
  • Publication number: 20100183898
    Abstract: A metallized substrate having, disposed in the order mentioned: a ceramics substrate; a high-melting point metal layer; a base nickel plating layer; a layered nickel-phosphorous plating layer; a diffusion-inhibiting plating layer; and a gold plating layer. The base nickel plating layer being any one of a nickel plating layer, a nickel-boron plating layer, or a nickel-cobalt plating layer. The diffusion-inhibiting plating layer being any one of a columnar nickel-phosphorous plating layer, a palladium-phosphorous plating layer, or a palladium plating layer. According to the above composition, even after heating the semiconductor chips in a mounted state, the metallized substrate can make the connection strength of wire bonding favorable.
    Type: Application
    Filed: June 10, 2008
    Publication date: July 22, 2010
    Applicant: TOKUYAMA CORPORATION
    Inventors: Tetsuo Imai, Osamu Yatabe, Masakatsu Maeda
  • Publication number: 20100178461
    Abstract: A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.
    Type: Application
    Filed: January 23, 2007
    Publication date: July 15, 2010
    Inventors: Yasuyuki Yamamoto, Osamu Yatabe, Masakatsu Maeda
  • Publication number: 20100015468
    Abstract: A method for manufacturing metallized aluminum nitride substrate. The method includes: Step A for forming a high-melting point metal layer over a sintered aluminum nitride substrate; Step B for forming over the high-melting point metal layer an intermediate metal layer of at least one selected from the group of: nickel, copper, copper-silver, copper-tin, and gold by plate processing; and Step C for forming a surface metal layer containing silver as a main component over the intermediate metal layer by coating a silver paste whose glass component content is 1 mass % or less and firing under nonoxidizing atmosphere. By this method, it is capable of forming a glass component-free silver layer which is adhered at a high degree of adhesion strength onto the high-melting point metal layer formed over the aluminum nitride substrate as a top face by thick-film method using a silver paste which makes thick-membrane forming easier.
    Type: Application
    Filed: December 21, 2007
    Publication date: January 21, 2010
    Inventors: Yasuyuki Yamamoto, Masakatsu Maeda, Osamu Yatabe
  • Patent number: 7625971
    Abstract: Disclosed are silica-filled rubber granules comprised of a cocoagulation product of rubber and silica, which are extremely less powdery and excellent in handling and kneading, as well as an industrially advantageous process for producing same. The silica-filled rubber granules of the present invention are dried granules of a cocoagulation product of rubber and silica particles, which are characterized in that an average particle diameter (D50) in terms of the sieve analysis is 300˜3000 ?m and the weight ratio of the granules within the range of D50±(D50×0.5) is at least 50% by weight. The silica-filled rubber granules are produced by supplying a cake of a cocoagulation product of silica and rubber having a water content of 40˜80% by weight to a drier provided with an indirect-heating type container having stirring wing blades, and then drying the cake while stirring it with the stirring wing blade.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: December 1, 2009
    Assignees: Tokuyama Corporation, Zeon Corporation
    Inventors: Shinji Tokunaga, Tsunetoshi Sugimura, Kazutaka Watanabe, Osamu Yatabe, Takeshi Karato, Takahiko Fukahori, Yoshihiro Chino
  • Patent number: 7619028
    Abstract: The present invention is to provide a diene rubber composition and a cross-linked diene rubber thereof excellent in tensile strength, wear resistance and processability, keeping compatibility of both good fuel efficiency and high gripping property, and a production method thereof. What is characterized in the composition is that the composition is comprised of 100 parts by weight of a diene rubber having a molecular weight distribution expressed in terms of the ratio of the weight-average molecular weight to the number-average molecular weight of 1.1 to 30, 20 to 200 parts by weight of silica and a cationic polymer, and that a toluene-insoluble rubber content per gram of the silica within the range from 0.2 to 1 g, and diene cross-linked rubber thereof.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: November 17, 2009
    Assignees: Tokuyama Corporation, Zeon Corporation
    Inventors: Kazutake Watanabe, Osamu Yatabe, Takeshi Karato, Yoshihiro Chino, Takahiko Fukahori
  • Publication number: 20070260005
    Abstract: A silica-containing conjugated diene rubber composition comprising a conjugated diene rubber-silica mixture (A) containing at least 30 wt % of toluene insoluble components obtainable by co-coagulating an aqueous dispersion or solution of conjugated diene rubber (a) having a glass transition temperature of ?120 to 0° C. with an aqueous dispersion of silica, blended with a conjugated diene rubber (b) having a glass transition temperature such that the difference in absolute value between the glass transition temperature of rubber (b) and that of rubber (a) is 3 to 100° C. According to the invention, it is possible to provide a rubber composition having highly balanced fuel efficiency, wet grip performance, mechanical strength, wear resistance and low temperature brittleness resistance; and suitably used for tire treads.
    Type: Application
    Filed: October 29, 2004
    Publication date: November 8, 2007
    Applicants: ZEON CORPORATION, Tokuyama Corporation
    Inventors: Takeshi Karato, Yoshihiro Chino, Kazutaka Watanabe, Osamu Yatabe
  • Publication number: 20070037916
    Abstract: The present invention is to provide a diene rubber composition and a cross-linked diene rubber thereof excellent in tensile strength, wear resistance and processability, keeping compatibility of both good fuel efficiency and high gripping property, and a production method thereof. What is characterized in the composition is that the composition is comprised of 100 parts by weight of a diene rubber having a molecular weight distribution expressed in terms of the ratio of the weight-average molecular weight to the number-average molecular weight of 1.1 to 30, 20 to 200 parts by weight of silica and a cationic polymer, and that a toluene-insoluble rubber content per gram of the silica within the range from 0.2 to 1 g, and diene cross-linked rubber thereof.
    Type: Application
    Filed: January 30, 2004
    Publication date: February 15, 2007
    Inventors: Kazutaka Watanabe, Osamu Yatabe, Takeshi Karato, Yoshihiro Chino, Takahiko Fukahori
  • Publication number: 20060281850
    Abstract: Disclosed are silica-filled rubber granules comprised of a cocoagulation product of rubber and silica, which are extremely less powdery and excellent in handling and kneading, as well as an industrially advantageous process for producing same. The silica-filled rubber granules of the present invention are dried granules of a cocoagulation product of rubber and silica particles, which are characterized in that an average particle diameter (D50) in terms of the sieve analysis is 300˜3000 ?m and the weight ratio of the granules within the range of D50±(D50×0.5) is at least 50% by weight. The silica-filled rubber granules are produced by supplying a cake of a cocoagulation product of silica and rubber having a water content of 40˜80% by weight to a drier provided with an indirect-heating type container having stirring wing blades, and then drying the cake while stirring it with the stirring wing blade.
    Type: Application
    Filed: August 19, 2004
    Publication date: December 14, 2006
    Applicants: Tokuyama Corporation, Zeon Corporation
    Inventors: Shinji Tokunaga, Tsunetoshi Sugimura, Kazutaka Watanabe, Osamu Yatabe, Takeshi Karato, Takahiko Fukahori, Yoshihiro Chino
  • Publication number: 20060143938
    Abstract: A silica-containing rubber composition produced by filtering slurry of silica-containing rubber crumbs obtained by co-coagulating a mixture of rubber latex and silica to give a moisture content of 80 wt % or less, dehydrating by a dehydrator having a compression function, then, drying. According to the present invention, a silica-containing rubber composition with improved silica dispersibility can be provided.
    Type: Application
    Filed: June 29, 2004
    Publication date: July 6, 2006
    Inventors: Takeshi Karato, Kazuhiro Hikida, Takahiko Fukahori, Yoshihiro Chino, Kazutaka Watanabe, Osamu Yatabe, Tsunetoshi Sugimura, Shinji Tokunaga