Patents by Inventor Osamu Yukawa

Osamu Yukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of providing semiconductor pellet with heat sink
    Patent number: 4123293
    Abstract: A method of providing a silicon semiconductor pellet with a heat sink and a semiconductor device with such a heat sink. The heat sink to which the pellet is bonded with a eutectic alloy of gold and silicon interposed therebetween consists mainly of copper and contains a small amount of a metal other than copper and has been subjected to an annealing treatment.
    Type: Grant
    Filed: March 3, 1976
    Date of Patent: October 31, 1978
    Assignee: Hitachi, Ltd.
    Inventors: Susumu Okikawa, Osamu Yukawa, Hiroshi Mikino, Yoshio Nonaka