Abstract: An assembly process for strip-shaped LED chips (112) in a row on a solid metal carrier (M) is to be specified. The observation of strictest tolerances in all three directions, i.e. in view of division spacing, trueness to line and surface planarity, is thereby required. On the other hand, an optimum thermal coupling to the metal carrier (M) is required for the illumination of the high dissipated heat from the LEDs (113) of a LED chip (112). The LED chips (112) are applied on to the metal carrier (M) in a transfer process. To that end, the LEDs have their faces glued onto an auxiliary carrier (H1) positioned with high precision and the LED row (114) prefabricated in this fashion is then soldered onto the previously solder-coated metal carrier (M). The auxiliary carrier (H1) is subsequently removed.

Abstract: A method for laser soldering of soldered connections of flexible wiring, which are provided at their contact points with a flux. The parts to be joined are held together by a clamp made of translucent material. The transmission of heat for the soldering process is provided by a non-contact laser beam. When the laser beam is applied the solder on both strip conductors melts. Upon removing the heat source the connection hardens to a solid solder joint.