Patents by Inventor Oskar Wirbser

Oskar Wirbser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • UV-curable adhesive semiconductor chip mounting process
    Patent number: 5366573
    Abstract: Assembly of semiconductor chips is accomplished using an acrylate-based adhesive which can be cured rapidly by UV light and which gives an adhesive bond that is resistant to soldering by can be readily removed by solvents after soldering. During assembly, the back sides of the semiconductor chips are bonded to a temporary carrier by the adhesive and adjusted to the proper mirror image position on the carrier before the adhesive is cured. The chip array is then soldered on a component and the temporary carrier is removed from the chips by a solvent.
    Type: Grant
    Filed: August 24, 1993
    Date of Patent: November 22, 1994
    Assignee: Siemens Nixdorf Informationssysteme AG
    Inventors: Heiner Bayer, Barbara Lehner, Oskar Wirbser, Gregor Unger
  • Process and device for unsoldering semiconductor modules in the flip-chip technique
    Patent number: 4066204
    Abstract: A method and device for unsoldering semiconductor modules which are soldered onto terminal surfaces of a carrier by terminals pads composed of soft solder is disclosed herein. A suction cup is placed onto a semiconductor module to be unsoldered and the terminal pads are melted. The suction cup is raised together with the semiconductor module, and, with a burst of compressed air, the semiconductor module is removed. The suction cup is then lowered onto the terminal surfaces and soft solder residues are melted and sucked away.
    Type: Grant
    Filed: June 14, 1976
    Date of Patent: January 3, 1978
    Assignee: Siemens Aktiengesellschaft
    Inventors: Oskar Wirbser, Nikolaus Ernst