Abstract: A mobile enclosure system includes a container and subsystems, including at least one of: a heating unit, a cooling unit, a humidity control unit, and a gas/vapor input unit. The system also includes sensors for monitoring environmental conditions within the container and generating environmental data, and a control unit connected with the subsystems and the sensors. The container includes a mobile foundation and a structural envelope on top of the mobile foundation. The control unit is configured for tracking power consumption by the plurality of subsystems coupled with the container, receiving the environmental data from the plurality of sensors, and modifying at least one operating parameter of the plurality of subsystems in accordance with the environmental data. In embodiments, the structural envelope is a permanent structure or includes insulated panels configured for repeated assembly and disassembly. The system may be compatible with multiple add-on packages for different applications.

Abstract: In a representative embodiment, an apparatus, comprises a substrate; a microelectronic ultrasonic transducer (MUT) disposed over the substrate; and a thermoelectric device disposed proximate to the MUT and configured to provide heat to or remove heat from the MUT. A microelectromechanical MEMs device is also described.

Abstract: An electronic package includes a die mounted on a first substrate; a second substrate disposed over the first substrate; a pillar wall extending between a surface of the die and an opposing surface of the second substrate to provide separation between the die and the second substrate, the pillar wall extending about a perimeter bounding the die and enclosing a cavity between the first and second substrates; and an encapsulating layer disposed over the first and second substrates and around the pillar wall. Substantially none of the encapsulating layer ingresses into the cavity.

Abstract: An electronic package includes a die mounted on a first substrate; a second substrate disposed over the first substrate; a pillar wall extending between a surface of the die and an opposing surface of the second substrate to provide separation between the die and the second substrate, the pillar wall extending about a perimeter bounding the die and enclosing a cavity between the first and second substrates; and an encapsulating layer disposed over the first and second substrates and around the pillar wall. Substantially none of the encapsulating layer ingresses into the cavity.

Abstract: In a representative embodiment, an electronic transmitter comprises a signal source configured to provide an input signal comprising a plurality of frequency components; and a plurality of transducers each configured to receive the input signal and each configured to resonate substantially at one frequency of a subset of the plurality of frequency components. An electronic receiver, an acoustic transmitter and an acoustic receiver are also described.

Abstract: An apparatus comprises a substrate and transducers disposed over the substrate, each of the transducers comprising a different resonance frequency. A transducer device comprises circuitry configured to transmit signals, or to receive signals, or both. The transducer device also comprises a transducer block comprising a plurality of piezoelectric ultrasonic transducers (PMUT), wherein each of the PMUTs; and an interconnect configured to provide signals from the transducer block to the circuitry and to provide signals from the circuitry to the transducer block.

Abstract: A transducer device includes first and second resonant elements and a common coupling cavity. The first resonant element includes a first membrane arranged over a first cavity in a substrate and a first transducer structure stacked on the first membrane. The second resonant element includes a second membrane arranged over a second cavity in the substrate. The common coupling cavity is configured to couple acoustic signals from the first and second resonant elements.

Abstract: A method of estimating the time and flight of an acoustic signal transmitted by a transmit acoustic transducer determines a difference in time between receiving the transmitted acoustic signal and receiving an electromagnetic wave transmitted by the transmit acoustic transducer coincident with transmitting the acoustic signal.

Abstract: A process control monitor for determination of alignment between layers of a semiconductor structure includes a patterned layer having a plurality of lines formed on a base layer, the plurality of lines enclosed within a circle. A photo-resist layer is deposited on top of the base layer and over the patterned layer. The photo-resist layer may be patterned to include an opening that exposes a portion of the base layer adjacent the patterned layer and that exposes a portion of the patterned layer. Alignment between the patterned layer and the patterned photo-resist layer may be determined according to a contrast between the exposed portion of the base layer and the exposed portion of the patterned layer.

Abstract: A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.

Abstract: A method of estimating the time of flight of a burst signal includes: receiving the burst signal; determining the slope of the phase characteristic of the Fourier transform of the received burst signal; and estimating the time-of-flight of the burst signal from the slope of the phase characteristic of the Fourier transform of the received burst signal.

Abstract: A transducer device includes an acoustic transducer, a parameter extractor and a feedback circuit. The parameter extractor is configured to extract an operating parameter from the acoustic transducer. The feedback circuit is configured to generate a correction signal based on a difference between the extracted operating parameter and a corresponding reference parameter. The correction signal is applied to adjust the operating parameter of the acoustic transducer.

Abstract: A device comprises: a first acoustic transducer; a second acoustic transducer; one or more transducer drivers; one or more signal receivers; and a transducer configuration device for selectively configuring connections between: (1) at least one of the first and second acoustic transducers; and (2) the one or more transducer drivers and the one or more signal receivers, according to a selected operating mode for the device among a plurality of possible operating modes.

Abstract: A horn coupled to multiple acoustic transducers includes first and second throat portions and a mixing area integrally formed with the first and second throat portions. The first throat portion has a first throat opening adjacent to a first transducer, and the second throat portion has a second throat opening adjacent to a second transducer. The mixing area includes a common mouth opening shared by the first and second throat portions for at least one of transmitting or receiving acoustic signals. At least one dimension of the first throat portion is different from a corresponding dimension of the second throat portion, so that a first cutoff frequency corresponding to the first throat portion is different from a second cutoff frequency corresponding to the second throat portion.

Abstract: A transducer device includes a coupling cavity, a first resonant element and a second resonant element. The first resonant element is coupled to the coupling cavity and configured to send or receive acoustic signals. The second resonant element is coupled to the coupling cavity and configured to modify a frequency response of the first resonant element via the coupling cavity.

Abstract: An integrated transducer device includes an optical transducer and an acoustic transducer integrally joined with the optical transducer. The acoustic transducer includes a membrane responsive to acoustic signals, the membrane being aligned with the optical transducer such that optical signals emitted or received by the optical transducer pass through the membrane. A propagation direction of the acoustic signals emitted or received by the acoustic transducer is collinear with a propagation direction of the optical signals emitted or received by the optical transducer.

Abstract: A device includes a die having: at least one of an electronic device and a microelectromechanical system, a package substrate, an electrically nonconductive interposer disposed between the die and the package substrate, at least a first adhesive layer disposed between the package substrate and the electrically nonconductive interposer, and at least a second adhesive layer disposed between the die and the electrically nonconductive interposer.

Abstract: A device, for transmitting or receiving ultrasonic signals, includes a transducer and an acoustic horn. The transducer is configured to convert between electrical energy and the ultrasonic signals, and may be a micro electro-mechanical system (MEMS) transducer. The acoustic horn is coupled to the transducer, and includes multiple apertures through which the ultrasonic signals are transmitted or received in order to manipulate at least one of a radiation pattern, frequency response or magnitude of the ultrasonic signals. The multiple apertures have different sizes.

Abstract: An apparatus comprises a first transducer support configured to receive a first transducer in a first opening. A face of the first face of the transducer is located in a first plane. The apparatus also comprises a second transducer support configured to receive a second transducer in a second opening. A face of the second transducer is located in a second plane substantially parallel to the first plane.

Abstract: A device, for transmitting or receiving ultrasonic signals, includes a transducer and an acoustic horn. The transducer is configured to convert between electrical energy and the ultrasonic signals, and may be a micro electromechanical system (MEMS) transducer. The acoustic horn is coupled to the transducer, and includes multiple apertures through which the ultrasonic signals are transmitted or received in order to manipulate at least one of a radiation pattern, frequency response or magnitude of the ultrasonic signals. The multiple apertures have different sizes.