Abstract: A method for manufacturing a component is described and includes providing at least one integrated circuit with an active main side on which a multiplicity of contact pads of the integrated circuit are located. In a second step, the at least one integrated circuit is applied to a base substrate, the active main side facing the base substrate. The at least one integrated circuit which is applied to the base substrate is then encapsulated with a sealing compound. In a subsequent step, at least parts of the base substrate are removed from the at least one encapsulated integrated circuit. The contact pads of the at least one integrated circuit are connected to electrically conductive bumps which themselves are applied directly to the base substrate.

Abstract: A reliable connection of a semiconductor component to a metal carrier is provided which avoids damage during bonding. A buffer material is applied between the semiconductor component and the metal carrier. Means are provided for fixing the buffer material during the bonding, such as a roughening of one or both surfaces in contact with the buffer material. Also, the metal carrier has a stiffening structure. Also, a weakening of the metal carrier can serve to increase the flexibility of the metal carrier and prevent damage thereto during bonding.