Patents by Inventor Oswald L. Skeete
Oswald L. Skeete has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220415943Abstract: Implementations of image sensor packages may include a plurality of microlenses coupled over a color filter array (CFA), a low refractive index layer directly coupled to and over the plurality of microlenses, an adhesive directly coupled to and over the low refractive index layer, and an optically transmissive cover directly coupled to and over the adhesive. Implementations may include no gap present between the optically transmissive cover and the plurality of microlenses.Type: ApplicationFiled: September 7, 2022Publication date: December 29, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Oswald L. SKEETE, Brian Anthony VAARTSTRA, Derek GOCHNOUR
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Patent number: 11462580Abstract: Implementations of image sensor packages may include a plurality of microlenses coupled over a color filter array (CFA), a low refractive index layer directly coupled to and over the plurality of microlenses, an adhesive directly coupled to and over the low refractive index layer, and an optically transmissive cover directly coupled to and over the adhesive. Implementations may include no gap present between the optically transmissive cover and the plurality of microlenses.Type: GrantFiled: June 27, 2019Date of Patent: October 4, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Oswald L. Skeete, Brian Anthony Vaartstra, Derek Gochnour
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Publication number: 20210325252Abstract: Implementations of sensing devices may include a plurality of electromagnetic radiation sensing sections coupled to a flexible interconnect and one or more digital sections coupled to the flexible interconnect. The plurality of electromagnetic radiation sensing sections may be self-aligned through the flexible interconnect.Type: ApplicationFiled: July 1, 2021Publication date: October 21, 2021Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Irfan RAHIM, Oswald L. SKEETE, Ross F. JATOU
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Patent number: 11079282Abstract: Implementations of sensing devices may include a plurality of electromagnetic radiation sensing sections coupled to a flexible interconnect and one or more digital sections coupled to the flexible interconnect. The plurality of electromagnetic radiation sensing sections may be self-aligned through the flexible interconnect.Type: GrantFiled: November 28, 2018Date of Patent: August 3, 2021Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Irfan Rahim, Oswald L. Skeete, Ross F. Jatou
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Publication number: 20200411573Abstract: Implementations of image sensor packages may include a plurality of microlenses coupled over a color filter array (CFA), a low refractive index layer directly coupled to and over the plurality of microlenses, an adhesive directly coupled to and over the low refractive index layer, and an optically transmissive cover directly coupled to and over the adhesive. Implementations may include no gap present between the optically transmissive cover and the plurality of microlenses.Type: ApplicationFiled: June 27, 2019Publication date: December 31, 2020Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Oswald L. SKEETE, Brian Anthony VAARTSTRA, Derek GOCHNOUR
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Publication number: 20200185451Abstract: Implementations of image sensors may include a die having either a rounded corner or a chamfered corner edge, and an optically transmissive cover coupled to the die. The optically transmissive cover may include either a rounded corner or a chamfered corner edge that corresponds with either the rounded corner or the chamfered corner edge of the die.Type: ApplicationFiled: February 20, 2020Publication date: June 11, 2020Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Oswald L. SKEETE
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Publication number: 20200166410Abstract: Implementations of sensing devices may include a plurality of electromagnetic radiation sensing sections coupled to a flexible interconnect and one or more digital sections coupled to the flexible interconnect. The plurality of electromagnetic radiation sensing sections may be self-aligned through the flexible interconnect.Type: ApplicationFiled: November 28, 2018Publication date: May 28, 2020Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Irfan RAHIM, Oswald L. SKEETE, Ross F. JATOU
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Patent number: 10608042Abstract: Implementations of image sensors may include a die having either a rounded corner or a chamfered corner edge, and an optically transmissive cover coupled to the die. The optically transmissive cover may include either a rounded corner or a chamfered corner edge that corresponds with either the rounded corner or the chamfered corner edge of the die.Type: GrantFiled: May 22, 2019Date of Patent: March 31, 2020Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Oswald L. Skeete
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Publication number: 20190273111Abstract: Implementations of image sensors may include a die having either a rounded corner or a chamfered corner edge, and an optically transmissive cover coupled to the die. The optically transmissive cover may include either a rounded corner or a chamfered corner edge that corresponds with either the rounded corner or the chamfered corner edge of the die.Type: ApplicationFiled: May 22, 2019Publication date: September 5, 2019Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Oswald L. SKEETE
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Patent number: 10340306Abstract: Implementations of image sensors may include a die having either a rounded corner or a chamfered corner edge, and an optically transmissive cover coupled to the die. The optically transmissive cover may include either a rounded corner or a chamfered corner edge that corresponds with either the rounded corner or the chamfered corner edge of the die.Type: GrantFiled: February 8, 2018Date of Patent: July 2, 2019Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Oswald L. Skeete
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Publication number: 20180226515Abstract: A semiconductor device has a first substrate with a vertical electrical interconnect structure formed between opposing surfaces of the first substrate. A semiconductor die is embedded within the first substrate. A plurality of semiconductor pellets is disposed over or within the first substrate. A first semiconductor pellet is doped to a first conductivity type, and a second semiconductor pellet is doped to a second conductivity type. A second thermally conductive substrate is disposed over the semiconductor pellets opposite the first substrate. An image sensor is disposed over the first substrate. The image sensor is electrically connected through the vertical electrical interconnect structure of the first substrate. An encapsulant is deposited over the image sensor with an opening in the encapsulant over an active region of the image sensor. Electric current is enabled through the semiconductor pellets for heat dissipation of the image sensor.Type: ApplicationFiled: February 6, 2017Publication date: August 9, 2018Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Oswald L. SKEETE
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Patent number: 8035216Abstract: Decoupling capacitors are frequently used in computer systems in order to control noise. In general, decoupling capacitors are placed as close as possible to the devices they protect in order to minimize the amount of line inductance and series resistance between the devices and the capacitors. An integrated circuit package includes a substrate (110, 210) having a first surface (111, 211) and an opposing second surface (112, 212), and a die platform (130, 230) adjacent to the first surface of the substrate. The substrate has a recess (120, 220) therein. The integrated circuit package further includes a capacitor (140, 240) in the recess of the substrate. The presence of a recess in the substrate provides an opportunity to reduce the separation distance between a die supported by the die platform and the decoupling capacitors. A further advantage of embodiments of the invention lies in its ability to maintain socket compatibility.Type: GrantFiled: February 22, 2008Date of Patent: October 11, 2011Assignee: Intel CorporationInventor: Oswald L. Skeete
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Publication number: 20090212416Abstract: An integrated circuit package includes a substrate (110, 210) having a first surface (111, 211) and an opposing second surface (112, 212), and a die platform (130, 230) adjacent to the first surface of the substrate. The substrate has a recess (120, 220) therein. The integrated circuit package further includes a capacitor (140, 240) in the recess of the substrate.Type: ApplicationFiled: February 22, 2008Publication date: August 27, 2009Inventor: Oswald L. Skeete
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Publication number: 20080156895Abstract: Apparatus and systems, as well as methods and articles, may operate to charge a quantity of flux using a first charge to provide a charged flux portion, dispense the charged flux portion toward a circuit, and direct distribution of the charged flux portion using a second charge to attract or repel the charged flux portion. Other embodiments are described and claimed.Type: ApplicationFiled: December 29, 2006Publication date: July 3, 2008Inventors: James P. Mellody, Sabina J. Houle, James C. Matayabas, Oswald L. Skeete
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Patent number: 7304381Abstract: In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.Type: GrantFiled: August 2, 2006Date of Patent: December 4, 2007Assignee: Intel CorporationInventors: Christopher L. Rumer, Sabina J. Houle, Oswald L. Skeete, Mike T. Reiter, Jeff R. Wienrich
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Publication number: 20040238947Abstract: In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.Type: ApplicationFiled: May 28, 2003Publication date: December 2, 2004Applicant: Intel CorporationInventors: Christopher L. Rumer, Sabina J. Houle, Oswald L. Skeete, Mike T. Reiter, Jeff R. Wienrich