Patents by Inventor Oswin M. Schreiber

Oswin M. Schreiber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible interconnect cable with first and second signal traces disposed between first and second ground traces so as to provide different line width and line spacing configurations
    Patent number: 8044746
    Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: October 25, 2011
    Assignee: QUALCOMM Incorporated
    Inventors: James Leroy Blair, Oswin M. Schreiber, Jeffrey Thomas Smith
  • FLEXIBLE INTERCONNECT CABLE FOR AN ELECTRONIC ASSEMBLY
    Publication number: 20100201462
    Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.
    Type: Application
    Filed: April 16, 2010
    Publication date: August 12, 2010
    Applicant: QUALCOMM Incorporated
    Inventors: James Leroy Blair, Oswin M. Schreiber, Jeffrey Thomas Smith
  • Flexible interconnect cable for an electronic assembly
    Patent number: 7719378
    Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: May 18, 2010
    Assignee: QUALCOMM Incorporated
    Inventors: James Leroy Blair, Oswin M. Schreiber, Jeffrey Thomas Smith
  • Flexible interconnect cable with grounded coplanar waveguide
    Patent number: 7336139
    Abstract: A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure. The cable can be coupled to destination components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: February 26, 2008
    Assignee: Applied Micro Circuits Corporation
    Inventors: James Leroy Blair, Oswin M. Schreiber, Jeffrey Thomas Smith
  • Flexible differential interconnect cable with isolated high frequency electrical transmission line
    Patent number: 7145411
    Abstract: A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure, a microstrip structure, a stripline structure, or the like. The cable can be coupled to destination components using a variety of connection techniques, e.g., direct bonding to a circuit substrate, direct soldering to a flip chip, mechanical attachment to a component, or integration with a circuit substrate. The cable can also be terminated with any number of known or standardized connector packages, e.g., SMA, GPPO, or V connectors.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: December 5, 2006
    Assignee: Applied Micro Circuits Corporation
    Inventors: James Leroy Blair, Oswin M. Schreiber, Jeffrey Thomas Smith
  • Flexible interconnect cable with high frequency electrical transmission line
    Patent number: 6797891
    Abstract: A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure, a microstrip structure, a stripline structure, or the like. The cable can be coupled to destination components using a variety of connection techniques, e.g., direct bonding to a circuit substrate, direct soldering to a flip chip, mechanical attachment to a component, or integration with a circuit substrate. The cable can also be terminated with any number of known or standardized connector packages, e.g., SMA, GPPO, or V connectors.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: September 28, 2004
    Assignee: Applied Micro Circuits Corporation
    Inventors: James Leroy Blair, Oswin M. Schreiber, Jeffrey Thomas Smith