Patents by Inventor Oswin Schreiber

Oswin Schreiber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080116988
    Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.
    Type: Application
    Filed: January 22, 2008
    Publication date: May 22, 2008
    Applicant: Applied Micro Circuits Corporation
    Inventors: James Blair, Oswin Schreiber, Jeffrey Smith
  • Publication number: 20070040626
    Abstract: A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure. The cable can be coupled to destination components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.
    Type: Application
    Filed: October 27, 2006
    Publication date: February 22, 2007
    Applicant: Applied Micro Circuits Corporation
    Inventors: James Blair, Oswin Schreiber, Jeffrey Smith