Abstract: A circuit board assembly for data equipment such as those having large numbers of layers and great power requirements in a small space having high computer performance, includes a multi-layer printed circuit board in laminated technology provided with voltage supply and signal carrying layers and pressure contacts at both sides connecting the multi-layer printed circuit board to further printed circuit boards. The further printed circuit boards, which are formed using micro-wiring technology, include backsides which are free of electrical components and connected to the pressure contacts and opposite sides carrying integrated electrical elements such as circuit chips forming an electrical circuit. Cooling plates are pressed against the surfaces of the circuit chips.

Abstract: A carrier member includes a rectangular frame formed by two flanges and two connecting webs around a central recess. A plurality of parallel guide channels for accepting lead wires of an integrated circuit module are provided in the flanges and in the connecting webs wherein the connecting webs have twice as many guide channels as the flanges. Retaining catch tabs are provided on the retaining webs in the central recess so that circuit modules are insertable therein which have lead wires extending from only two opposite sides and, alternately, circuit modules which have lead wires extending in identical numbers from all four sides.

Abstract: For the purpose of protecting film-mounted, integrated circuits (micropacks) against destruction due to electrostatic charging, each micropack is inserted in a mounting frame after it is cut from the film strip, is fixed there and tested. Subsequently, a short-circuit frame having conductive elements which short the outer track structures of the micropack is placed into the mounting frame and fixed there. The micropack remains between the two frames until its final assembly. The short-circuit frame is removable and reuseable.

Abstract: For the purpose of processing individual, integrated circuits into film-mounted, integrated circuits (micropacks), a plate having recesses exhibiting the size of the individual chips disposed matrix-like is secured to a highly plane-parallel carrier plate consisting of material exhibiting poor thermal conductivity, the individual chips are placed in the recess of said plate, and the overall arrangement is further processed in an automatic contacting machine in a known manner.

Abstract: This invention provides for increased precision position adjustment for carrier film supported micro-packs in which the carrier film has applied thereto a conductive pattern producing a contact array emminating from a function unit such as a microchip carried by the carrier film. Precise adjustment of the conductive pattern relative to the terminals of the function unit is provided for by arranging the carrier film as a film having the width of, for example, standard cinema film (35 mm), but however using the marginal film transport perforations of a miniature film (8 mm) and in addition providing two adjustment openings per contact array which have larger dimensions equivalent to the transport dimensions of the cinema film.