Patents by Inventor OtoKinetics Inc.

OtoKinetics Inc. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140275728
    Abstract: According to an exemplary embodiment the hearing of a patient may be improved by providing the patient with a wearable package having a microphone, a wireless transmitter circuit responsive to the microphone to transmit a wireless transducer signal, a power storage device configured to provide power to the transmitter circuit; and a wireless power transmission circuit configured to transmit a wireless power signal and implanting into the patient an electrically powered microactuator having: a wireless receiver circuit to receive the wireless transducer signal; a transducer drive circuit coupled to the wireless receiver circuit to convert the received transducer signal into a transducer drive signal; a transducer coupled to the transducer drive circuit to convert the transducer drive signal into motion; and a wireless power reception circuit configured to receive the wireless power signal to power the transducer drive circuit.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Applicant: OtoKinetics Inc.
    Inventor: OtoKinetics Inc.
  • Publication number: 20140172099
    Abstract: A method for increasing the acoustic impedance of the round window membrane of the cochlea in a human patient includes surgically opening access to the round window membrane and placing a packing layer over the round window membrane. Optionally a layer of collagen graft may be obtained from the patient and placed between the round window membrane and the packing layer. Optionally the packing layer may be enclosed within the collagen graft. Optionally bone paté may be obtained from the patient and used to form at least a portion of the packing layer. Optionally a silastic buttress may be placed under compression between the packing layer and the bone of sinus tympani of the patient.
    Type: Application
    Filed: December 13, 2012
    Publication date: June 19, 2014
    Applicant: OTOKINETICS INC.
    Inventor: OtoKinetics Inc.