Abstract: The present disclosure provides for electrical connectivity to high temperature film sensor devices (e.g., temperature sensor devices). More particularly, the present disclosure provides for high temperature, thin film sensor devices (e.g., temperature sensor devices) having connection of wires and cabling from the cold side to the thin film sensor on the hot side. The disclosure provides assemblies and methods for that electrical connection to the leads or traces of the thin film sensor device (e.g., thin film temperature sensor device such as a thermocouple or a resistance temperature detector device) at the hot-cold barrier that exists in high temperature components (e.g., high temperature components in aero turbine engine applications). The assemblies and methods of the disclosure can be applied to any thin film device (e.g., sensor devices, such as, for example, strain gauges, heat flux sensors, etc.) that can be applied to the surface of a high temperature component.

Abstract: The present disclosure is generally directed to an RFID tag for use with a metal fastener where the fastener operates as the antenna of the RFID tag. The RFID tag includes a microchip for storing data. The chip is electrically coupled to the metal fastener in order to receive and transmit the RF signal, the metal fastener thereby operating as the antenna for the RFID tag.

Abstract: The present disclosure is generally directed to an RFID tag for use with a metal fastener where the fastener operates as the antenna of the RFID tag. The RFID tag includes a microchip for storing data. The chip is electrically coupled to the metal fastener in order to receive and transmit the RF signal, the metal fastener thereby operating as the antenna for the RFID tag.

Abstract: The present disclosure is generally directed to an RFID tag for use with a metal fastener where the fastener operates as the antenna of the RFID tag. The RFID tag includes a microchip for storing data. The chip is electrically coupled to the metal fastener in order to receive and transmit the RF signal, the metal fastener thereby operating as the antenna for the RFID tag.

Abstract: The present disclosure is generally directed to an RFID tag for use with a metal fastener where the fastener operates as the antenna of the RFID tag. The RFID tag includes a microchip for storing data. The chip is electrically coupled to the metal fastener in order to receive and transmit the RF signal, the metal fastener thereby operating as the antenna for the RFID tag.

Abstract: The subject of the present invention relates to a device that can be applied to the surface of a ceramic matrix composites (CMC) in such a way that the CMC itself will contribute to the extraordinarily large thermoelectric power. The present invention obtains greater resolution of temperature measurements, which can be obtained at exceedingly high temperatures.

Abstract: The present disclosure is generally directed to an RFID tag for use with a metal fastener where the fastener operates as the antenna of the RFID tag. The RFID tag includes a microchip for storing data. The chip is electrically coupled to the metal fastener in order to receive and transmit the RF signal, the metal fastener thereby operating as the antenna for the RFID tag.

Abstract: The present disclosure is generally directed to an RFID tag for use with a metal fastener where the fastener operates as the antenna of the RFID tag. The RFID tag includes a microchip for storing data. The chip is electrically coupled to the metal fastener in order to receive and transmit the RF signal, the metal fastener thereby operating as the antenna for the RFID tag.

Abstract: Strain gages for use with ceramic matrix composites (CMCs), and methods of manufacture therefore. The strain gages use the CMC as a strain element. For semiconductor CMCs, for example SiC fiber-reinforced SiC CMC, their large gage factor enables high sensitivity, high accuracy strain measurements at high temperatures. By using a single elemental metal such as platinum, or another high temperature conductive material, the strain gages can operate at temperatures over 1600° C. The conductive material is preferably deposited on a dielectric or insulating layer, and contacts the CMC substrate through openings in that layer. The materials can be deposited using thin film vacuum techniques or thick film techniques such as pastes or inks. The strain gages can be configured to measure only the mechanical strain independent of the apparent or thermal strain. The strain gages can be incorporated into a bulk CMC structure during layup, and can optionally measure the strain of only desired fiber weave orientations.

Abstract: Strain gages for use with ceramic matrix composites (CMCs), and methods of manufacture therefore. The strain gages use the CMC as a strain element. For semiconductor CMCs, for example SiC fiber-reinforced SiC CMC, their large gage factor enables high sensitivity, high accuracy strain measurements at high temperatures. By using a single elemental metal such as platinum, or another high temperature conductive material, the strain gages can operate at temperatures over 1600° C. The conductive material is preferably deposited on a dielectric or insulating layer, and contacts the CMC substrate through openings in that layer. The materials can be deposited using thin film vacuum techniques or thick film techniques such as pastes or inks. The strain gages can be configured to measure only the mechanical strain independent of the apparent or thermal strain. The strain gages can be incorporated into a bulk CMC structure during layup, and can optionally measure the strain of only desired fiber weave orientations.

Abstract: The subject of the present invention relates to a device that can be applied to the surface of a ceramic matrix composites (CMC) in such a way that the CMC itself will contribute to the extraordinarily large thermoelectric power. The present invention obtains greater resolution of temperature measurements, which can be obtained at exceedingly high temperatures.

Abstract: A thin film ceramic thermocouple (10) having two ceramic thermocouple (12, 14) that are in contact with each other in at least on point to form a junction, and wherein each element was prepared in a different oxygen/nitrogen/argon plasma. Since each element is prepared under different plasma conditions, they have different electrical conductivity and different charge carrier concentration. The thin film thermocouple (10) can be transparent. A versatile ceramic sensor system having an RTD heat flux sensor can be combined with a thermocouple and a strain sensor to yield a multifunctional ceramic sensor array. The transparent ceramic temperature sensor that could ultimately be used for calibration of optical sensors.

Abstract: A thin film ceramic thermocouple (10) having two ceramic thermocouple (12, 14) that are in contact with each other in at least on point to form a junction, and wherein each element was prepared in a different oxygen/nitrogen/argon plasma. Since each element is prepared under different plasma conditions, they have different electrical conductivity and different charge carrier concentration. The thin film thermocouple (10) can be transparent. A versatile ceramic sensor system having an RTD heat flux sensor can be combined with a thermocouple and a strain sensor to yield a multifunctional ceramic sensor array. The transparent ceramic temperature sensor that could ultimately be used for calibration of optical sensors.

Abstract: A system and method of using a passive wireless gauge to detect the physical properties on an object.

Abstract: A panoramic image management system and method is disclosed. The system provides for improved calibration of a 360 degree panoramic camera, as well as improved means for manipulating the images, and correlating images from conventional video cameras with the images from the 360 degree panoramic camera. The system also provides means for archiving and retrieving stored images. The present invention contributes to an improved video surveillance system.

Abstract: An improved camera for the acquisition of panoramic images is disclosed. The camera comprises a convex photochromic reflector directed towards an image capture element. Multiple incoming light sensors around the perimeter of the camera detect strong incoming light and cause the activation of a corresponding UV light. The UV light in turn activates the photochromic effect on a particular region of the photochromic reflector that corresponds to an area of strong incident light. The photochromic reflector then darkens in that area, providing compensation for a scene that has a wide range of lighting conditions. Therefore, the camera compensates for strong lighting indoors as well as outdoors.

Abstract: An intermediate thermal expansion coefficient coating including an NiCoCrAly alloy. The coating contains nanoparticles of the alloy and alumina. A nanocomposite coating is placed on metals to protect them from high gas temperatures by providing thermal insulation. The nanocomposite coating includes a bond coating, an intermediate thermal expansion coefficient coating, and a ceramic top coat. The intermediate thermal expansion coefficient coating comprises a NiCoCrAly alloy and allumina nanoparticles and has a ceramic top coat which is based on zirconi or high purity alumina.

Abstract: A system and method of using a passive wireless gauge to detect the physical properties on an object.

Abstract: A panoramic image management system and method is disclosed. The system provides for improved calibration of a 360 degree panoramic camera, as well as improved means for manipulating the images, and correlating images from conventional video cameras with the images from the 360 degree panoramic camera. The system also provides means for archiving and retrieving stored images. The present invention contributes to an improved video surveillance system.

Abstract: A superalloy article which comprises a substrate comprised of a superalloy, a bond coat comprised of MCrAlY wherein M is a metal selected from the group consisting of cobalt, nickel and mixtures thereof applied onto at least a portion of the substrate and a ceramic top coat applied over at least a portion of the bond coat. The bond coat is exposed to a temperature of within the range of between about 1600-1800° F. subsequent to its application onto the substrate.