Patents by Inventor Ouan Yang

Ouan Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Diffusion bonded nickel-copper powder metallurgy powder
    Publication number: 20060222554
    Abstract: In contrast to current industrial practice where alloying powders are added to starting powder metallurgy compositions either as powder mixtures or fully prealloyed powders, the present invention posits a diffusion bonded nickel-copper precursor additive mixture for direct one step addition to the starting powder metallurgy master blend composition. Segregation and dusting are substantially reduced and the mechanical properties of the resultant compact are improved.
    Type: Application
    Filed: April 4, 2005
    Publication date: October 5, 2006
    Inventors: Tajpreet Singh, Scott Campbell, Thomas Stephenson, Ouan Yang