Abstract: The present disclosure provides a jig for manufacturing probe card for semiconductor inspection, a probe alignment system comprising same, and a probe card manufactured thereby.

Abstract: Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.

Abstract: Provided is a probe card and method of fabricating the same. This method comprises forming soldering bumpers electrically connected to conductive patterns on a substrate, forming probes connected to the conductive patterns and supported by the soldering bumpers, and then melting the soldering bumpers to fixing the probes to the substrate. Forming the soldering bumpers includes a step of forming the soldering bumpers in the same pattern and size by means of a photolithography process.

Abstract: Disclosed is a vertical probe and methods of fabricating and bonding the same. The probe is comprised of a contactor equipped with two tips, a connector electrically linking with a measuring terminal of a measurement system, And a bump connecting the contactor to the connector and buffing physical stress to the contactor.

Abstract: Disclosed herein are a probe positioning and bonding device and a probe bonding method, and more particularly a probe positioning and bonding device used to fix probes to prescribed positions on a substrate so that a probe card used for semiconductor integrated circuit testing equipment is manufactured, and a probe bonding method using the same. The probe positioning and bonding device comprises a stage unit disposed on a working table, a microscope disposed above the stage unit while being supported by means of a first supporting member disposed on the working table, a probe fixing unit disposed above the stage unit and below the microscope while being supported by means of a second supporting member disposed on the working table, and a light source unit supported by means of a third supporting member disposed on the working table. The light source unit is disposed toward the upper part of the stage unit.

Abstract: Disclosed is an electrical contact element used to test an electronic device. The electrical contact element has a beam portion and a tip portion attached to an end of the beam portion. In representative embodiments, a part of the beam portion is bent, e.g., such that the beam portion is zigzagged one or more times. A projection may be formed around a proximal end of the tip portion.

Abstract: Provided is a probe card and method of fabricating the same. This method comprises forming soldering bumpers electrically connected to conductive patterns on a substrate, forming probes connected to the conductive patterns and supported by the soldering bumpers, and then melting the soldering bumpers to fixing the probes to the substrate. Forming the soldering bumpers includes a step of forming the soldering bumpers in the same pattern and size by means of a photolithography process.

Abstract: Disclosed is a vertical probe and methods of fabricating and bonding the same. The probe is comprised of a contactor equipped with two tips, a connector electrically linking with a measuring terminal of a measurement system, And a bump connecting the contactor to the connector and buffing physical stress to the contactor.

Abstract: The present invention relates to a method for arranging a plurality of connecting elements corresponding to a plurality of electronic components which is required to be subject to an electric test for inspecting a fault. The method for arranging a plurality of connecting elements on electronic substrates such that the connecting elements may simultaneously contact with a plurality of electronic components comprises the steps of fabricating each connecting element to have the first extending region at one end extended in a certain direction with a regular width and the second extending region at the other end extended in a certain direction with a regular width; and coupling the first extending region of each connecting element to a fixing post formed in a pre-determined region of the electronic substrate in order to be parallel with the second extending region of each connecting element, wherein each of the second extending region extends at the same length.

Abstract: A method of repairing defects to a patterned polymer mask for a photolithography process is described, illustrated, and claimed. Generally, there are two types of defects to a polymer mask, which are an ink spot on a transparent polymer substrate and an ink void in a patterned area. The ink spot is repaired by an effective ablation by a laser that does not substantially affect a transparency of the polymer substrate. The ink void is repaired by various embodiments using laser-assisted touch-up processes, wherein the laser-assisted touch-up restores the void to block UV light during a photolithography exposure.

Abstract: The present invention relates to a contact tip structure of a connecting element designed for electric testing of electronic components. The connecting element comprises a fixing post coupled to a first electronic component; a beam extending away from said fixing post; a base coupled at one end of the said beam; and a contact tip extending vertically from the bottom surface of the said base. The beam includes an elastic region and an inelastic region extending at a shorter distance than the elastic region. The base vertically extends from the inelastic region in a certain distance and the horizontally extended length (L) of the elastic region of the beam and the vertically extended length (D) of the base are determined such that the contact tip is horizontally extended at a pre-determined distance according to the following formula: Dsin ?+L(cos ??1)(? means an angle of elastic deformation of the beam).

Abstract: In a bone conduction speaker, a body has a shape of a cylinder, and a vibrating plate is inserted to a mastoid to close an upper opening portion of the body. An auxiliary vibrating plate is inserted to the mastoid under the vibrating plate. A vibrating coil is attached on a lower side of the auxiliary vibrating plate. A speaker plate is fixed at an inner central portion of the body, and a ring type magnet is fixed on the speaker plate. An edge portion of a yoke is fixed on the ring type magnet and a central portion of the yoke has a protrusion which protrudes in the inside direction of a central hole of the speaker plate. An acoustic vibrating plate is fixed at a lower portion of the body, and an acoustic coil is fixed on the acoustic vibrating plate.

Abstract: A probe card includes a first micro probe head (MPH), a second MPH, and needles. The first MPH includes first conductive traces into which a test signal for testing an object having outer terminals is inputted. The second MPH includes second conductive traces electrically connected to the first conductive traces, respectively, and arranged corresponding to the outer terminals. The second MPH is detachably combined with the first MPH. The needles are electrically connected to the second conductive traces, respectively, to make contact with the outer terminals, respectively. Thus, only the second MPH may be replaced with a new one in accordance with alterations to the object so that time and costs for manufacturing the probe card may be reduced.

Abstract: A method for fabricating a vertical-type electric contactor includes forming a first passivation pattern on a sacrificial substrate for forming at least one tip; performing an etch process, using the first passivation pattern as an etch mask, to form a trench in the sacrificial substrate; removing the first passivation pattern and forming a second passivation pattern to offer a space for forming a support beam, wherein the tip is merged with one end of the support beam; filling the trench and the space with a conductive material to form a tip and a support beam; forming a third passivation pattern on a sacrificial substrate including the tip and the support beam to offer a space for forming a hollow body; filling the space offered by the third passivation pattern with a conductive material to form a hollow body; bonding the hollow body with a bump formed on a micro-probe head (MPH); and removing the sacrificial substrate to open a tip of an electric contactor.

Abstract: Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.

Abstract: The present invention relates to a subminiature bone conduction speaker by using a vibrating plate and a mobile phone having the subminiature bone conduction speaker.

Abstract: Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.

Abstract: The present invention relates to a bone conduction speaker using a vibrating plate.

Abstract: The present invention relates to a hollow microprobe using an MEMS technique and a method of manufacturing the same.

Abstract: Disclosed is an electrical contact element used to test an electronic device. The electrical contact element has a beam portion and a tip portion attached to an end of the beam portion. In representative embodiments, a part of the beam portion is bent, e.g., such that the beam portion is zigzagged one or more times. A projection may be formed around a proximal end of the tip portion.