Abstract: In one embodiment, a system includes a first thermoelectric assembly that includes a first set of thermoelectric elements and a first plate and a second plate are coupled to the first set of thermoelectric elements. A second thermoelectric assembly is spaced apart from the first thermoelectric assembly. It includes a second set of thermoelectric elements and a third plate and a fourth plate are coupled to the second set of thermoelectric elements. A first set of fins is coupled to the first plate and a second set of fins is coupled to the third plate. A third set of fins is coupled to the second plate and a fourth set of fins is coupled to the fourth plate. A fan is coupled to the first and second sets of fins and is substantially centered with respect to a gap between the first and second sets of fins.

Abstract: In one embodiment, a system includes a strap configured to be coupled to a container. The strap includes a plurality of plates arranged to allow the strap to flex. The system also includes a thermoelectric device coupled to the strap. The strap is configured to transfer heat between the thermoelectric device and the container. The system includes a thermal interface situated between the thermoelectric device and the strap.

Abstract: In one embodiment, a system includes a first thermoelectric assembly that includes a first set of thermoelectric elements and a first plate and a second plate are coupled to the first set of thermoelectric elements. A second thermoelectric assembly is spaced apart from the first thermoelectric assembly. It includes a second set of thermoelectric elements and a third plate and a fourth plate are coupled to the second set of thermoelectric elements. A first set of fins is coupled to the first plate and a second set of fins is coupled to the third plate. A third set of fins is coupled to the second plate and a fourth set of fins is coupled to the fourth plate. A fan is coupled to the first and second sets of fins and is substantially centered with respect to a gap between the first and second sets of fins.

Abstract: In one embodiment, a system includes a strap configured to be coupled to a container. The strap includes a plurality of plates arranged to allow the strap to flex. The system also includes a thermoelectric device coupled to the strap. The strap is configured to transfer heat between the thermoelectric device and the container. The system includes a thermal interface situated between the thermoelectric device and the strap.

Abstract: A cooling apparatus for removing heat having a low profile unitary member. The low profile unitary member has an evaporator portion and a condenser portion. The evaporator portion is thermally exposed to a heat generating component. The condenser portion is disposed at an elevated angle with respect to the evaporator portion. A plurality of microtubes are disposed within the first low profile extrusion. The plurality of microtubes have a heat transfer fluid contained therein. A second plurality of low profile extrusion members are mounted as fins on the evaporator section of the low profile unitary member. Heat is transferred from the heat generating component to the heat transfer fluid contained with the microtubes located within the evaporator portion. The heat transfer fluid to which the heat was transferred migrates to the condenser portion of the low profile unitary member by way of the microtubes. The heat transfer fluid is cooled in the condenser portion of the low profile unitary member.

Abstract: In one embodiment, a thermoelectric device includes a plurality of thermoelectric elements arranged in a substantially polygonal pattern. The substantially polygonal pattern has more than four sides. The device includes a first dielectric plate coupled to the thermoelectric elements and a second dielectric plate coupled to the thermoelectric elements. The device also includes a first set of fins coupled to the first dielectric plate and a second set of fins coupled to the second dielectric plate.

Abstract: A cooling apparatus for removing heat having a low profile unitary member. The low profile unitary member has an evaporator portion and a condenser portion. The evaporator portion is thermally exposed to a heat generating component. The condenser portion is disposed at an elevated angle with respect to the evaporator portion. A plurality of microtubes are disposed within the first low profile extrusion. The plurality of microtubes have a heat transfer fluid contained therein. A second plurality of low profile extrusion members are mounted as fins on the evaporator section of the low profile unitary member. Heat is transferred from the heat generating component to the heat transfer fluid contained with the microtubes located within the evaporator portion. The heat transfer fluid to which the heat was transferred migrates to the condenser portion of the low profile unitary member by way of the microtubes. The heat transfer fluid is cooled in the condenser portion of the low profile unitary member.

Abstract: A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.

Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.

Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.

Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.

Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.

Abstract: A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.

Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.

Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.

Abstract: A cooling apparatus using “low profile extrusions” is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in applications where space is limited. A cooling system in accordance with the present invention is illustrated for use in a typical wireless telecommunication base station for removing heat from power amplifiers and other electronic components. Cooling is carried out by drawing heat away from the electronic components and into at least one low profile extrusion attached directly to the heat generating components or a heat sink, and transferring the removed heat to a cooling fluid circulating through a plurality of micro tubes or channels within each low profile extrusion.