Abstract: Examples described herein provide for testing of a test socket using multiple insertions to a contact resistance (CRES) test system. In an example, the test socket is placed in a first orientation on an interface board electrically connected to a test system. Using the test system and through the interface board, a first subset of probes of the test socket is tested while the test socket is in the first orientation on the interface board. The test socket is placed in a second orientation different from the first orientation on the interface board. Using the test system and through the interface board, a second subset of probes of the test socket is tested while the test socket is in the second orientation on the interface board. At least some probes of the second subset of probes are different from the first subset of probes.

Abstract: An interposer block, a chip package assembly test system and method for testing a chip package assembly are described herein. In one example, an interposer block for an integrated circuit chip package test system is provided. The interposer block includes a main body, a retainer plate, and a cover plate. A plurality of spring pins are each disposed in a respective one of a plurality of spring pin receiving holes formed in the main body. The retainer plate is coupled to the main body and captures the spring pins within the plurality of spring pin receiving holes. The cover plate is movably coupled to the main body. The cover plate has a plurality of spring pin clearance holes form therethrough that align with the plurality of spring pin receiving holes formed in the main body.

Abstract: An interposer block, a chip package assembly test system and method for testing a chip package assembly are described herein. In one example, an interposer block for an integrated circuit chip package test system is provided. The interposer block includes a main body, a retainer plate, and a cover plate. A plurality of spring pins are each disposed in a respective one of a plurality of spring pin receiving holes formed in the main body. The retainer plate is coupled to the main body and captures the spring pins within the plurality of spring pin receiving holes. The cover plate is movably coupled to the main body. The cover plate has a plurality of spring pin clearance holes form therethrough that align with the plurality of spring pin receiving holes formed in the main body.