Patents by Inventor Owais Jamil

Owais Jamil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a microelectronic package
    Patent number: 7188413
    Abstract: A microelectronic element is formed from a structure including metal layers on top and bottom sides of a dielectric. Apertures are formed in the top metal layer, and vias are formed in the dielectric in alignment with the apertures. Top and bottom conductive features are formed in proximity to the vias, as by selectively depositing a metal on the metal layers or selectively etching the metal layers. The top and bottom conductive features are connected to one another by depositing a conductive material into the vias, most preferably without seeding the vias as, for example, by depositing solder in the vias.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: March 13, 2007
    Assignee: Tessera, Inc.
    Inventor: Owais Jamil
  • Connection component with peelable leads
    Patent number: 7067742
    Abstract: A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: June 27, 2006
    Assignee: Tessera, Inc.
    Inventors: Thomas H. DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light, John W. Smith
  • Method of making a microelectronic package including a component having conductive elements on a top side and a bottom side thereof
    Publication number: 20040078963
    Abstract: A microelectronic element is formed from a structure including metal layers on top and bottom sides of a dielectric. Apertures are formed in the top metal layer, and vias are formed in the dielectric in alignment with the apertures. Top and bottom conductive features are formed in proximity to the vias, as by selectively depositing a metal on the metal layers or selectively etching the metal layers. The top and bottom conductive features are connected to one another by depositing a conductive material into the vias, most preferably without seeding the vias as, for example, by depositing solder in the vias.
    Type: Application
    Filed: December 4, 2003
    Publication date: April 29, 2004
    Applicant: Tessera, Inc.
    Inventor: Owais Jamil
  • Method of making a microelectronic package including a component having conductive elements on a top side and a bottom side thereof
    Patent number: 6678952
    Abstract: A microelectronic element is formed from a structure including metal layers on top and bottom sides of a dielectric. Apertures are formed in the top metal layer, and vias are formed in the dielectric in alignment with the apertures. Top and bottom conductive features are formed in proximity to the vias, as by selectively depositing a metal on the metal layers or selectively etching the metal layers. The top and bottom conductive features are connected to one another by depositing a conductive material into the vias, most preferably without seeding the vias as, for example, by depositing solder in the vias.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: January 20, 2004
    Assignee: Tessera, Inc.
    Inventor: Owais Jamil
  • Connection component with peelable leads
    Publication number: 20020081781
    Abstract: A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.
    Type: Application
    Filed: December 28, 2001
    Publication date: June 27, 2002
    Inventors: Thomas H. DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light, John W. Smith
  • Method of making a microelectronic package including a component having conductive elements on a top side and a bottom side thereof
    Publication number: 20020078561
    Abstract: A microelectronic element is formed from a structure including metal layers on top and bottom sides of a dielectric. Apertures are formed in the top metal layer, and vias are formed in the dielectric in alignment with the apertures. Top and bottom conductive features are formed in proximity to the vias, as by selectively depositing a metal on the metal layers or selectively etching the metal layers. The top and bottom conductive features are connected to one another by depositing a conductive material into the vias, most preferably without seeding the vias as, for example, by depositing solder in the vias.
    Type: Application
    Filed: July 27, 2001
    Publication date: June 27, 2002
    Inventor: Owais Jamil
  • Method of making connection component
    Patent number: 6357112
    Abstract: A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: March 19, 2002
    Assignee: Tessera, Inc.
    Inventors: Thomas H. DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light, John W. Smith