Patents by Inventor Owen Fong
Owen Fong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230335414Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: March 21, 2023Publication date: October 19, 2023Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph A. KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Patent number: 11610787Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: December 1, 2020Date of Patent: March 21, 2023Assignee: Brooks Automation US, LLCInventors: Christopher Hofmeister, Martin R. Elliott, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20210175096Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: December 1, 2020Publication date: June 10, 2021Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph A. KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C, BLAHNIK, Ho Yin Owen FONG
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Patent number: 10854478Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: December 20, 2019Date of Patent: December 1, 2020Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliott, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20200126820Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: December 20, 2019Publication date: April 23, 2020Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph A. KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Patent number: 10541157Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: October 24, 2016Date of Patent: January 21, 2020Assignee: BROOKS AUTOMATION, INC.Inventors: Christopher Hofmeister, Martin R. Elliott, Alexander Krupyshev, Joseph Hallisey, Joseph Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20180226280Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: October 24, 2016Publication date: August 9, 2018Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Publication number: 20180114708Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: October 24, 2016Publication date: April 26, 2018Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Patent number: 9478446Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: March 3, 2014Date of Patent: October 25, 2016Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Patent number: 9318306Abstract: In some embodiments, apparatus are provided that provide for flexible processing in both high productivity combinatorial (HPC) and full wafer modes. The apparatus allow for interchangeable functionality that includes deposition with different sizes of targets, plasma treatment, ion beam treatment, and in-situ metrology. The functional modules are designed so that the modules may be interchanged with minimal effort and reduced system downtime.Type: GrantFiled: December 20, 2013Date of Patent: April 19, 2016Assignee: Intermolecular, Inc.Inventors: Owen Fong, Timothy Franklin, Stephen Charles Garner, James Tsung
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Publication number: 20150176117Abstract: In some embodiments, apparatus are provided that provide for flexible processing in both high productivity combinatorial (HPC) and full wafer modes. The apparatus allow for interchangeable functionality that includes deposition with different sizes of targets, plasma treatment, ion beam treatment, and in-situ metrology. The functional modules are designed so that the modules may be interchanged with minimal effort and reduced system downtime.Type: ApplicationFiled: December 20, 2013Publication date: June 25, 2015Applicant: Intermolecular, Inc.Inventors: Owen Fong, Timothy Franklin, Stephen Charles Garner, James Tsung
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Publication number: 20150025670Abstract: Substrate processing including correction for deposition location is described, including a combinatorial processing chamber that incorporates the correction. The combinatorial processing chamber can be used to process multiple regions of a substrate using different processing parameters on different regions. For example, one region can have one material deposited on it and another region can have a different material deposited on it, although other combinations and variations are possible. The combinatorial processing chamber uses a rotating and revolving substrate pedestal to be able to deposit on all locations or positions on a substrate. The combinatorial processing chamber uses a correction factor that accounts for variations in alignment and/or configuration of the processing chamber so that the actual location of deposition of a region is approximately the same as a desired location of deposition.Type: ApplicationFiled: October 2, 2014Publication date: January 22, 2015Inventors: Jeremy Cheng, Indranil De, Ho Yin Owen Fong, Zhendong Hong, Dan Wang
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Patent number: 8882917Abstract: Substrate processing including correction for deposition location is described, including a combinatorial processing chamber that incorporates the correction. The combinatorial processing chamber can be used to process multiple regions of a substrate using different processing parameters on different regions. For example, one region can have one material deposited on it and another region can have a different material deposited on it, although other combinations and variations are possible. The combinatorial processing chamber uses a rotating and revolving substrate pedestal to be able to deposit on all locations or positions on a substrate. The combinatorial processing chamber uses a correction factor that accounts for variations in alignment and/or configuration of the processing chamber so that the actual location of deposition of a region is approximately the same as a desired location of deposition.Type: GrantFiled: December 31, 2009Date of Patent: November 11, 2014Assignee: Intermolecular, Inc.Inventors: Jeremy Cheng, Ho Yin Owen Fong, Dan Wang, Zhendong Hong, Indranil De
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Publication number: 20140178157Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: March 3, 2014Publication date: June 26, 2014Applicant: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Patent number: 8662812Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: September 24, 2012Date of Patent: March 4, 2014Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Patent number: 8575027Abstract: Provided are methods and systems for forming discreet multilayered structures. Each structure may be deposited by in situ deposition of multiple layers at one of multiple site isolation regions provided on the same substrate for use in combinatorial processing. Alignment of different layers within each structure is provided by using two or more differently sized openings in-between one or more sputtering targets and substrate. Specifically, deposition of a first layer is performed through the first opening that defines a first deposition area. A shutter having a second smaller opening is then positioned in-between the one or more targets and substrate. Sputtering of a second layer is then performed through this second opening that defines a second deposition area. This second deposition area may be located within the first deposition area based on sizing and alignment of the openings as well as alignment of the substrate.Type: GrantFiled: June 26, 2012Date of Patent: November 5, 2013Assignee: Intermolecular, Inc.Inventors: Sean Barstow, Owen Fong
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Patent number: 8272825Abstract: A substrate processing tool including a frame forming at least one isolatable chamber configured to hold a controlled atmosphere, at least two substrate supports located within each of the at least one isolatable chamber, each of the at least two substrate supports being stacked one above the other and configured to hold a respective substrate and a cooling unit communicably coupled to the at least two substrate supports such that the at least two substrate supports and cooling unit effect simultaneous conductive cooling of each of the respective substrates located on the at least two substrate supports.Type: GrantFiled: May 19, 2008Date of Patent: September 25, 2012Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong