Patents by Inventor Owen H. Decker

Owen H. Decker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5011721
    Abstract: Chemorheologically viscosity tailored matrix resin formulation for use in forming prepregs and filament wound composite articles and having a specified viscosity profile comprising a curable matrix resin and an effective amount of a reactive resin curing agent reactive at room temperature and a latent resin curing agent substantially non-reactive at room temperature but activated upon heating or radiation such that the matrix resin formulation is adapted upon formulation to have a viscosity sufficiently low enough to enable the matrix resin to impregnate a filament or fiber at room temperature without the necessity for the application of heat or solvent and which, upon standing at room temperature after impregnation into the fiber or filament to form a prepreg composition, rises in viscosity to a viscosity level sufficiently high to prevent substantially any bleed of the matrix resin from winding tension upon spooling of the prepreg yet of sufficiently low enough viscosity to allow the prepreg to tack and dra
    Type: Grant
    Filed: October 16, 1989
    Date of Patent: April 30, 1991
    Assignee: Thiokol Corporation
    Inventors: Owen H. Decker, Neal A. Mumford