Abstract: Methods and systems are described for fabricating a component using 3D printing. A 3D printed piece is created including a body of the component, a support structure, and a first sacrificial interface region coupling the body of the component to the support structure. The body of the component is formed of a first metal or ceramic material and the first sacrificial interface region is formed at least partially of a second metal or ceramic material. The body of the component is then separated from the support structure by applying a chemical or electrochemical dissolution process to the 3D printed piece. Because the second metal or ceramic material is less resistant to the dissolution process than the first metal or ceramic material, the first sacrificial interface region at least partially dissolves, thereby separating the body of the metal component from the support structure, without dissolving the body of the component.

Abstract: Systems and methods are disclosed for fabricating a metal or ceramic component using a 3D printer. An entire 3D printed piece, including both the metal or ceramic component and one or more support structures, is created of a first metal or ceramic material. A sensitization layer is applied to all or part of the 3D printed piece to chemically alter portions of the first metal or ceramic material near the surface making those portions of the material more sensitive to the etching process. The etching process causes the affected material to deplete and separates the component from the support structures without requiring mechanical machining.

Abstract: A method is provided to remove a selective amount of material from a metal component fabricated by additive manufacturing in a self-terminating manner. The method can be used to remove support structures and trapped powder from a metal component as well as to smooth surfaces of a 3D printed metal component. In some embodiments, selected surfaces of the metal component are treated to make the selected surfaces at least one of mechanically and chemically unstable. The unstable portion of the metal support can then be removed chemically, electrochemically, or through vapor-phase etching. The method can be used for processing any fluid or vapor-accessible regions and surfaces of a 3D printed metal component.

Abstract: Systems and methods for optimizing morphology and electrical properties of silver printed on a substrate with a particular implementation in photovoltaic manufacturing techniques. The system comprises a substrate, a printer jet head having a nozzle to dispense a reactive metal ink and a solvent onto the substrate, and wherein the solvent and a temperature of the substrate are controlled during deposition of the reactive metal ink onto the substrate to produce a dense film in the absence of sintering.

Abstract: Methods and systems are described for fabricating a component using 3D printing. A 3D printed piece is created including a body of the component, a support structure, and a first sacrificial interface region coupling the body of the component to the support structure. The body of the component is formed of a first metal or ceramic material and the first sacrificial interface region is formed at least partially of a second metal or ceramic material. The body of the component is then separated from the support structure by applying a chemical or electrochemical dissolution process to the 3D printed piece. Because the second metal or ceramic material is less resistant to the dissolution process than the first metal or ceramic material, the first sacrificial interface region at least partially dissolves, thereby separating the body of the metal component from the support structure, without dissolving the body of the component.

Abstract: Systems and methods for optimizing morphology and electrical properties of silver printed on a substrate with a particular implementation in photovoltaic manufacturing techniques. The system comprises a substrate, a printer jet head having a nozzle to dispense a reactive metal ink and a solvent onto the substrate, and wherein the solvent and a temperature of the substrate are controlled during deposition of the reactive metal ink onto the substrate to produce a dense film in the absence of sintering.

Abstract: Systems and methods are disclosed for fabricating a metal or ceramic component using a 3D printer. An entire 3D printed piece, including both the metal or ceramic component and one or more support structures, is created of a first metal or ceramic material. A sensitization layer is applied to all or part of the 3D printed piece to chemically alter portions of the first metal or ceramic material near the surface making those portions of the material more sensitive to the etching process. The etching process causes the affected material to deplete and separates the component from the support structures without requiring mechanical machining.

Abstract: Systems and methods are described for a non-contact method for positioning a tip of an object. A light beam of known dimensions is projected and a position of the tip of the object relative to the light beam is adjusted. Light scatter indicative of the tip of the object being positioned within the dimensions of the light beam is detected and a position of the tip of the object is determined based at least in part on the known dimensions of the light beam and the detected light scatter.

Abstract: Methods and chemistries are described to form electrically conductive adhesion promoters for use with reactive inks. In some implementations, a metal ink is printed on a substrate. An adhesion promoter is deposited on the surface of the substrate. The adhesion promoter reacts to form a covalent bond with the substrate. Subsequently, a reactive metal ink is used to print on a substrate using a drop-on-demand printing process. The reactive metal ink includes metal cations that react with the adhesion promoter-treated substrate surface to form a conductive bond between the adhesion promoter-treated substrate surface and a metal of the reactive metal ink.

Abstract: Systems and methods are described for fabricating a metal or ceramic component using 3D printing. A 3D printed piece is created that includes a body of the component and a support structure. While the 3D printed piece is created using a single printing material, one or more processing parameters are adjusted while printing a first sacrificial interface region coupling the body of the component to the support structure. The body of the component is separated from the support structure by applying a chemical or electrochemical dissolution process to the 3D printed piece. The adjustment to the one or more processing parameters during printing of the first sacrificial interface region creates a localized area that is less resistant to the chemical or electrochemical dissolution process than the body of the component.

Abstract: Methods and chemistries are described to form electrically conductive adhesion promoters for use with reactive inks. In some implementations, a metal ink is printed on a substrate. An adhesion promoter is deposited on the surface of the substrate. The adhesion promoter reacts to form a covalent bond with the substrate. Subsequently, a reactive metal ink is used to print on a substrate using a drop-on-demand printing process. The reactive metal ink includes metal cations that react with the adhesion promoter-treated substrate surface to form a conductive bond between the adhesion promoter-treated substrate surface and a metal of the reactive metal ink.

Abstract: A process for etching includes disposing an activating catalyst on a substrate; providing a vapor composition that includes an etchant oxidizer, an activatable etchant, or a combination thereof; contacting the activating catalyst with the etchant oxidizer; contacting the substrate with the activatable etchant; performing an oxidation-reduction reaction between the substrate, the activatable etchant, and the etchant oxidizer in a presence of the activating catalyst and the vapor composition; forming an etchant product that includes a plurality of atoms from the substrate; and removing the etchant product from the substrate to etch the substrate.

Abstract: A process for depositing a metal includes disposing an activating catalyst on a substrate; contacting the activating catalyst with a metal cation from a vapor deposition composition; contacting the substrate with a reducing anion from the vapor deposition composition; performing an oxidation-reduction reaction between the metal cation and the reducing anion in a presence of the activating catalyst; and forming a metal from the metal cation to deposit the metal on the substrate. A system for depositing a metal includes an activating catalyst to deposit on a substrate; and a primary reagent to form: a metal cation to deposit on the substrate as a metal; and a reducing anion to provide electrons to the activating catalyst, the metal cation, the substrate, or a combination thereof, wherein the primary reagent forms the metal cation and the reducing anion in response to being subjected to a dissociating condition.

Abstract: Systems and methods are described for a non-contact method for positioning a tip of an object. A light beam of known dimensions is projected and a position of the tip of the object relative to the light beam is adjusted. Light scatter indicative of the tip of the object being positioned within the dimensions of the light beam is detected and a position of the tip of the object is determined based at least in part on the known dimensions of the light beam and the detected light scatter.

Abstract: A process for etching includes disposing an activating catalyst on a substrate; providing a vapor composition that includes an etchant oxidizer, an activatable etchant, or a combination thereof; contacting the activating catalyst with the etchant oxidizer; contacting the substrate with the activatable etchant; performing an oxidation-reduction reaction between the substrate, the activatable etchant, and the etchant oxidizer in a presence of the activating catalyst and the vapor composition; forming an etchant product that includes a plurality of atoms from the substrate; and removing the etchant product from the substrate to etch the substrate.

Abstract: An article includes a substrate; and a coating disposed on the substrate that includes a microporous layer; a gradient in a density of a volume of the microporous layer, and a plurality of dendritic veins that are anisotropically disposed in the coating. A process for forming a coating includes disposing an activating catalyst on a substrate; introducing an activatable etchant; introducing an etchant oxidizer, performing an oxidation-reduction reaction between the substrate, the activatable etchant, and the etchant oxidizer in a presence of the activating catalyst, the oxidation-reduction reaction occurring in a liquid medium including the activatable etchant; and the etchant oxidizer, forming an etchant product comprising atoms from the substrate; removing a portion of the etchant product from the substrate; and forming a dendritic vein in the substrate to form the coating, the dendritic vein being anisotropically disposed in the coating.

Abstract: A process for etching includes disposing an activating catalyst on a substrate; providing a vapor composition that includes an etchant oxidizer, an activatable etchant, or a combination thereof; contacting the activating catalyst with the etchant oxidizer; contacting the substrate with the activatable etchant; performing an oxidation-reduction reaction between the substrate, the activatable etchant, and the etchant oxidizer in a presence of the activating catalyst and the vapor composition; forming an etchant product that includes a plurality of atoms from the substrate; and removing the etchant product from the substrate to etch the substrate.

Abstract: A process for depositing a metal includes disposing an activating catalyst on a substrate; contacting the activating catalyst with a metal cation from a vapor deposition composition; contacting the substrate with a reducing anion from the vapor deposition composition; performing an oxidation-reduction reaction between the metal cation and the reducing anion in a presence of the activating catalyst; and forming a metal from the metal cation to deposit the metal on the substrate.

Abstract: An article includes a substrate; and a coating disposed on the substrate that includes a microporous layer; a gradient in a density of a volume of the microporous layer, and a plurality of dendritic veins that are anisotropically disposed in the coating. A process for forming a coating includes disposing an activating catalyst on a substrate; introducing an activatable etchant; introducing an etchant oxidizer, performing an oxidation-reduction reaction between the substrate, the activatable etchant, and the etchant oxidizer in a presence of the activating catalyst, the oxidation-reduction reaction occurring in a liquid medium including the activatable etchant; and the etchant oxidizer, forming an etchant product comprising atoms from the substrate; removing a portion of the etchant product from the substrate; and forming a dendritic vein in the substrate to form the coating, the dendritic vein being anisotropically disposed in the coating.

Abstract: Disclosed herein are various embodiments related to metal-assisted chemical etching of substrates on the micron, sub-micron and nano scales. In one embodiment, among others, a method for metal-assisted chemical etching includes providing a substrate; depositing a non-spherical metal catalyst on a surface of the substrate; etching the substrate by exposing the non-spherical metal catalyst and the substrate to an etchant solution including a composition of a fluoride etchant and an oxidizing agent; and removing the etched substrate from the etchant solution.