Abstract: A variety of lead configurations for use in packaged semiconductors, the leads including integral finger locking mechanisms to prevent leads from pulling out of an encapsulated package, and their method of manufacture. Each finger is comprised of a bent portion of the lead and has a length of approximately two to four times the thickness of the lead body. A finger may be integrally located at the lead tip or, where the lead includes one or more tabs, a finger may extend from any number of the tab edges. Any number of leads within a semiconductor package may incorporate a finger, and each lead may incorporate a plurality of fingers. A method of manufacturing the finger locking mechanism of the current invention includes forming a lead frame in a conductive strip, wherein the lead tips are separated from the die attach pad, so as to retain a sufficient length of each lead in appropriate locations to accommodate the formation of fingers by bending.