Patents by Inventor OWEN P COLUMBUS

OWEN P COLUMBUS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230284406
    Abstract: Example latching assemblies and electronic devices including the latching assemblies are disclosed. In an example, an electronic device includes a housing including a cavity to receive a peripheral device therein. In addition, the electronic device includes a latching assembly disposed within the housing. The latching assembly includes a latch biased toward the cavity to engage with the peripheral device, and a block. Displacement of the block is to slidingly engage the block along the latch and thereby withdraw the latch from the cavity.
    Type: Application
    Filed: January 30, 2020
    Publication date: September 7, 2023
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Cheng-Yi Yang, Timothy Arthur Kubicki, Owen P. Columbus, Matthew William Tivnon
  • Publication number: 20220217870
    Abstract: Example devices include a graphics processing unit (GPU), a central processing unit (CPU), and a vapor chamber. The 0 vapor chamber includes a first side in contact with the CPU and a second side in contact with the GPU. In addition, the vapor chamber includes a fluid disposed therein that is to vaporize to transfer heat from the GPU and the CPU.
    Type: Application
    Filed: September 6, 2019
    Publication date: July 7, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Owen P. Columbus, Jamil Abdul Wakil, Monji G. Jabori, Xiang Ma, Rafael Ibanez
  • Patent number: 11297411
    Abstract: According to examples, an apparatus may include a chamber having a hole and a microphone unit. The microphone unit may include a first substrate having a first opening aligned with the hole of the chamber, a second substrate positioned with respect to the first substrate to form a gap between the second substrate and the first substrate, the second substrate having a second opening, and a diaphragm housed within the gap formed between the first substrate and the second substrate, in which the first opening is positioned on a first side of the diaphragm and the second opening is positioned on a second side of the diaphragm.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: April 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Owen P. Columbus
  • Publication number: 20220104367
    Abstract: A hinge system may include a flat panel to hold a computing device thereon; a hinge coupled to the flat panel to flip the flat panel over to selectively present the computing device to one of a first and second facing users, the hinge including a clutch bearing that allows for rotation relative to a shaft in a first direction to a first of the facing users but prevents rotation of the clutch bearing relative to a shaft in a second direction; and a dampening device to allow for selective rotation of the shaft in the second direction.
    Type: Application
    Filed: January 9, 2019
    Publication date: March 31, 2022
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Matthew William Tivnon, Ken Maclean, Owen P. Columbus
  • Publication number: 20220063314
    Abstract: A vertical column printing device may include a print engine formed within a base housing of the vertical column printing device; a door biased by a spring away from the print engine to be selectively opened to expose the print engine; and a geared platen formed on the door to interface with the print engine to drive a roll of paper past the print engine when the door is engaged with the based housing.
    Type: Application
    Filed: January 9, 2019
    Publication date: March 3, 2022
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Matthew William Tivnon, Owen P. Columbus, Ken Maclean, Mickey Chia-Yu Yuan, Yun Fei Zhu
  • Publication number: 20210368271
    Abstract: An example acoustic transducer device includes a magnet and a pole plate connected to the magnet. The pole plate includes a nickel-iron alloy having nickel as a principal component. The device further includes a diaphragm movable relative to the pole plate to generate a sound and a coil connected to the diaphragm. The coil is to extend into a gap at the pole plate. The coil is to magnetically interact with a magnetic field provided to the gap by the magnet and the pole plate to drive the diaphragm.
    Type: Application
    Filed: February 26, 2018
    Publication date: November 25, 2021
    Inventors: OWEN P COLUMBUS, KEN MacLEAN, PHILIP WRIGHT
  • Publication number: 20210173491
    Abstract: Example implementations relate to keyboard keys. In some examples, a key of a keyboard may comprise a magnetic plate, a pole plate located adjacent to the magnetic plate, where a channel through the magnetic plate and the pole plate is located adjacent to a perimeter edge of the magnetic plate and a perimeter edge of the pole plate, a membrane covering the pole plate and the channel, a keycap located on top of the membrane, and a wire coil connected to the keycap and located in the channel.
    Type: Application
    Filed: February 8, 2018
    Publication date: June 10, 2021
    Inventors: OWEN P COLUMBUS, KEN MacLEAN
  • Publication number: 20210136950
    Abstract: In some examples, an electronic device includes a first housing providing a sealed inner chamber, an electronic component inside the sealed inner chamber, a second housing externally of the first housing, the second housing comprising a first opening and a second opening, and an airflow channel between the first housing and second housing, the airflow channel to direct airflow from the first opening to the second opening through the airflow channel to carry heat away from a surface of the first housing.
    Type: Application
    Filed: October 4, 2016
    Publication date: May 6, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Timothy J. SUTHERLAND, Philip H. WRIGHT, Owen P. COLUMBUS
  • Publication number: 20210037310
    Abstract: According to examples, an apparatus may include a chamber having a hole and a microphone unit. The microphone unit may include a first substrate having a first opening aligned with the hole of the chamber, a second substrate positioned with respect to the first substrate to form a gap between the second substrate and the first substrate, the second substrate having a second opening, and a diaphragm housed within the gap formed between the first substrate and the second substrate, in which the first opening is positioned on a first side of the diaphragm and the second opening is positioned on a second side of the diaphragm.
    Type: Application
    Filed: March 30, 2018
    Publication date: February 4, 2021
    Inventor: OWEN P COLUMBUS
  • Patent number: D986308
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: May 16, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David Quijano, Stacy L. Wolff, Owen P. Columbus, Paul L. Drew, Marcus Hoggarth, Cian Plumbe, Seong Min Hwang, Ben Henley, Benjamin Keep, Jaineel Shah
  • Patent number: D989047
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: June 13, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David Quijano, Stacy L. Wolff, Owen P. Columbus, Paul L. Drew, Marcus Hoggarth, Cian Plumbe, Seong Min Hwang, Ben Henley, Benjamin Keep, Jaineel Shah
  • Patent number: D991250
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: July 4, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David Quijano, Stacy L. Wolff, Owen P. Columbus, Paul L. Drew, Marcus Hoggarth, Cian Plumbe, Seong Min Hwang, Ben Henley, Benjamin Keep, Jaineel Shah
  • Patent number: D997902
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: September 5, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David Quijano, Stacy L. Wolff, Owen P. Columbus, Paul L. Drew, Marcus Hoggarth, Cian Plumbe, Seong Min Hwang, Ben Henley, Benjamin Keep, Jaineel Shah