Patents by Inventor Owen Richard Fay

Owen Richard Fay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for processing a semiconductor substrate having a copper surface disposed thereon and structure formed
    Publication number: 20020058150
    Abstract: A semiconductor wafer having copper bondpads (17) that are free of voids (13) and a method for coating the copper bondpads (17) with solderable or wirebondable metals such that the copper bondpads (17) are free of the voids (13). The void free metal coatings are achieved using a dual activation process. In a first activation step (27), the copper bondpads (17) are activated by placing them in a palladium bath. In a second activation step (28), the bondpads are placed in a nickel—boron bath. After the dual activation, the copper bondpads (17) are coated with a layer of nickel—phosphorous or palladium. The nickel—phosphorous or palladium layer may be coated with a layer of gold for subsequent formation of solder balls or wirebonds thereon.
    Type: Application
    Filed: November 27, 2001
    Publication date: May 16, 2002
    Inventors: Jaynal Abedin Molla, Owen Richard Fay
  • Method for processing a semiconductor substrate having a copper surface disposed thereon and structure formed
    Patent number: 6362089
    Abstract: A semiconductor wafer having copper bondpads (17) that are free of voids (13) and a method for coating the copper bondpads (17) with solderable or wirebondable metals such that the copper bondpads (17) are free of the voids (13). The void free metal coatings are achieved using a dual activation process. In a first activation step (27), the copper bondpads (17) are activated by placing them in a palladium bath. In a second activation step (28), the bondpads are placed in a nickel-boron bath. After the dual activation, the copper bondpads (17) are coated with a layer of nickel-phosphorous or palladium. The nickel-phosphorous or palladium layer may be coated with a layer of gold for subsequent formation of solder balls or wirebonds thereon.
    Type: Grant
    Filed: April 19, 1999
    Date of Patent: March 26, 2002
    Assignee: Motorola, Inc.
    Inventors: Jaynal Abedin Molla, Owen Richard Fay