Patents by Inventor Owen Wang

Owen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250050394
    Abstract: A recycling process for exhausted, end-of-life solar panels achieves substantial recovery of silicon and silver, as well as other materials, from a recycling stream of discarded solar panels. Agitation and shredding of the solar panels yield a granular mass, which can be separated by particle size to yield the silicon rich solar cell material. Leaching with a strong base such as sodium hydroxide draws the silicon into the leach solution. Filtration of the leach solution draws off the silicon-rich solution and allows filtration of other valuable materials such as silver. Addition of an acid such as hydrochloric acid to the leach solution then precipitates the silicon into a nano silica powder of in the form of high purity silicon dioxide. The high purity silicon dioxide provides raw materials for recycled solar panels, lithium-ion batteries and other uses depending on the purity.
    Type: Application
    Filed: August 12, 2024
    Publication date: February 13, 2025
    Inventors: Yan Wang, Xiaotu MA, Owen Wang
  • Publication number: 20120018880
    Abstract: A semiconductor structure and a manufacture method thereof are disclosed. The semiconductor structure includes a semiconductor wafer having a plurality of semiconductor device dies, wherein each of the semiconductor device dies includes a die body, a metal wiring layer, a bump, and a metal layer. The metal wiring layer is formed on the die body while the bump is formed on the metal wiring layer during the semiconductor front-end-of-line (FEOL) process and protrudes from the die body. The metal layer is disposed on one side of the bump opposite to the metal wiring layer, wherein the activity of the metal layer is smaller than the activity of the bump. In this way, the semiconductor structure of the present invention is easy to be manufactured and the manufacture cost is also reduced.
    Type: Application
    Filed: June 29, 2011
    Publication date: January 26, 2012
    Inventors: Kun-Tai Wu, Ching-San Lin, Owen Wang