Patents by Inventor Oya F. Larsen

Oya F. Larsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit interconnect having dual dielectric intermediate layer
    Patent number: 5070037
    Abstract: This invention comprehends a multilevel electrically conductive interconnect for an integrated circuit wherein an inventive feature of the interconnect is the intermediate dual dielectric layer between the non-contacting portions of the surrounding metal conductors. The dual dielectric layer consists of a first dielectric layer and a second dielectric layer preferably formed from a polyimide material. The dual dielectric layer provides a significant improvement in defect density and a substantially planarized surface for the deposition of the top conductor, thereby improving the reliability and integrity of the electrical interconnection and integrated circuit.
    Type: Grant
    Filed: August 31, 1989
    Date of Patent: December 3, 1991
    Assignee: Delco Electronics Corporation
    Inventors: Ronald K. Leisure, Oya F. Larsen, Ronald K. Reger