Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: An electronic device may be provided with wireless circuitry and control circuitry. The wireless circuitry may communicate with a wireless base station using a 5G New Radio (NR) communications protocol. The wireless circuitry may include a phased antenna array. The electronic device may perform antenna scaling operations in which the active antennas in the phased antenna array change over time to optimize wireless performance and power consumption. The electronic device may inform the base station when antenna scaling operations have occurred. This may allow the base station to compensate for power density discontinuities associated with the antenna scaling operations. If desired, the base station may break transmit and receive signal beam correspondence and the electronic device may use different antenna scaling settings for transmitting and receiving signals.

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: An electronic device may be provided with wireless circuitry and control circuitry. The wireless circuitry may communicate with a wireless base station using a 5G New Radio (NR) communications protocol. The wireless circuitry may include a phased antenna array. The electronic device may perform antenna scaling operations in which the active antennas in the phased antenna array change over time to optimize wireless performance and power consumption. The electronic device may inform the base station when antenna scaling operations have occurred. This may allow the base station to compensate for power density discontinuities associated with the antenna scaling operations. If desired, the base station may break transmit and receive signal beam correspondence and the electronic device may use different antenna scaling settings for transmitting and receiving signals.

Abstract: An RF transceiver device, for use in an RF system, includes a chip package comprising one or more circuit components, a signal cable, and an antenna block. The signal cable is configured to carry signals sent to the chip package or received from the chip package. The signal cable has a first surface and a second surface. The chip package is directly coupled to the first surface of the signal cable. The antenna block comprises one or more antennas and is directly coupled to the second surface of the signal cable. By directly coupling the chip package and antenna block to the signal cable, bulky connectors are no longer needed thus reducing the total footprint of the transceiver device and increasing signal fidelity. The arrangement may be integrated with, for example, a PCB or a communication system.

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.