Abstract: A multi-core processor system includes a first resource, a first core, a second resource, and a second core. The first core runs a first operating system (OS), and the first resource is allocated to the first OS. The second core runs a second OS, and the second resource is exclusively allocated to the second OS. The first OS and the second OS are designed for running at the same time, and the second OS is configured for monitoring or debugging the first resource, the first core, or the first OS.

Abstract: A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.

Abstract: A package structure for packaging at least one of a plurality of intergraded circuit devices of a wafer is provided. The package structure includes an extension metal pad, a first conductive bump and an insulator layer. The extension metal pad electrically contacts the at least one of the plurality of intergraded circuit devices. The first conductive bump is located on the extension metal pad. The insulator layer is located over the at least one of the plurality of intergraded circuit devices and on a sidewall of it.

Abstract: A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.

Abstract: A package structure for packaging at least one of a plurality of integrated circuit devices of a wafer is provided. The package structure includes an extension metal pad, a first conductive bump and an insulator layer. The extension metal pad electrically contacts the at least one of the plurality of integrated circuit devices. The first conductive bump is located on the extension metal pad. The insulator layer is located over the at least one of the plurality of integrated circuit devices and on a sidewall of it.

Abstract: A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.

Abstract: A package structure for packaging at least one of a plurality of integrated circuit devices of a wafer is provided. The package structure includes an extension metal pad, a first conductive bump and an insulator layer. The extension metal pad electrically contacts the at least one of the plurality of integrated circuit devices. The first conductive bump is located on the extension metal pad. The insulator layer is located over the at least one of the plurality of integrated circuit devices and on a sidewall of it.

Abstract: A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.

Abstract: A photo monitoring apparatus including a photoresistor, a series of shunt resistors, and a comparator IC, wherein the comparator IC provides an output signal to a LED and a diaphragm speaker, when the voltage from the shunt resistors drops below a pre-set reference voltage, causing the LED to give light and the diaphragm speaker to produce a warning sound. The shell of the photo monitoring apparatus is installed with a digital time display controlled by a time circuit to indicate time.

Abstract: A fan-type exercise bicycle with adjustable resistance friction assemblies on the lower ends of its handlebars. Each friction assembly includes a knob with a bolt protruding from it, a two-piece casing, two friction pads and a friction plate which is clamped between the friction pads and the casing pieces. The bolt extends through the casing pieces and friction pads and through a curved slot in the friction plate. A threaded insert is fixed in a support stand of the fan-type bicycle. The threaded insert also protrudes slightly from the support stand so that the casing pieces are clamped between the knob and the threaded insert.