Patents by Inventor P. C. Liu

P. C. Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of molding a bump chip carrier and structure made thereby
    Patent number: 6306685
    Abstract: A method of molding a bump chip carrier is disclosed, which includes at least the following sequential steps: a step of applying dry films: applying dry films to the top and bottom surface of a copper base plate having a suitable thickness; a step of forming a circuit pattern on each one of the dry films: forming a circuit pattern on each one of the dry films by a photo engraving process; a step of plating: plating variable metals (arranged in a desired sequence) onto each of the circuit patterns to form connection pads and an exothermic passage; a step of removing the dry films; a step of mounting and wire-bonding a die: fixedly mounting a die on the copper base plate and bonding the die to the connection pads by wires; a step of molding: molding the surfaces of the copper base plate on which the die is mounted to form a molding layer; and a step of removing parts of the copper base plate: etching out of the exposed parts of copper base plate situated on the bottom of the molding layer.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: October 23, 2001
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: P. C. Liu, Shih-Ching Chang