Patents by Inventor PR Patel

PR Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling system for semiconductor devices
    Patent number: 8410602
    Abstract: In one embodiment, the present invention includes a socket for a semiconductor package, where the socket has a frame with a segmented design, where socket streets are located between the segments. One or more of the streets may include a conduit to enable thermal transfer during operation of the semiconductor package. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: April 2, 2013
    Assignee: Intel Corporation
    Inventors: Venkat Natarajan, Arun Chandrasekhar, Pr Patel, Vittal Kini
  • Cooling system for semiconductor devices
    Publication number: 20090096086
    Abstract: In one embodiment, the present invention includes a socket for a semiconductor package, where the socket has a frame with a segmented design, where socket streets are located between the segments. One or more of the streets may include a conduit to enable thermal transfer during operation of the semiconductor package. Other embodiments are described and claimed.
    Type: Application
    Filed: October 15, 2007
    Publication date: April 16, 2009
    Inventors: Venkat Natarajan, Arun Chandrasekhar, Pr Patel, Vittal Kini
  • Laminated socket contacts
    Patent number: 6979208
    Abstract: A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: December 27, 2005
    Assignee: Intel Corporation
    Inventors: Hong Xie, Ram Viswanath, Pr Patel
  • Laminated socket contacts
    Publication number: 20050085106
    Abstract: A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.
    Type: Application
    Filed: August 19, 2004
    Publication date: April 21, 2005
    Inventors: Hong Xie, Ram Viswanath, Pr Patel
  • Laminated socket contacts
    Patent number: 6854979
    Abstract: A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: February 15, 2005
    Assignee: Intel Corporation
    Inventors: Hong Xie, Ram Viswanath, PR Patel
  • Laminated socket contacts
    Patent number: 6672880
    Abstract: A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: January 6, 2004
    Assignee: Intel Corporation
    Inventors: Hong Xie, Ram Viswanath, PR Patel
  • Laminated socket contacts
    Publication number: 20030162420
    Abstract: A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.
    Type: Application
    Filed: December 19, 2002
    Publication date: August 28, 2003
    Inventors: Hong Xie, Ram Viswanath, Pr Patel
  • Laminated socket contacts
    Patent number: 6575766
    Abstract: A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: June 10, 2003
    Assignee: Intel Corporation
    Inventors: Hong Xie, Ram Viswanath, PR Patel