Abstract: Methods for acoustically separating an epitaxial layer or device from a growth substrate are described. In an embodiment, a particle layer is deposited on a first top surface of the growth substrate to provide partial coverage of the first top surface, an epitaxial layer is deposited over the particle layer and a remaining uncovered portion of the first top surface, and acoustic waves are directed at the growth substrate to initiate controlled crack propagation along the particle layer and separate the epitaxial layer from the first top surface, creating a second top surface of the growth substrate.

Abstract: An acoustic cleaving system are described for initiating and controlling crack propagation. In an embodiment, the system includes an acoustic generator that includes a piezoelectric device; a high-voltage power supply; and an acoustic cleaving circuit. The acoustic cleaving circuit includes a push-pull circuit coupled to the piezoelectric device and coupled to the high-voltage power supply, and a capacitor bank that includes one or more capacitors coupled in parallel to the push-pull circuit. In one embodiment, the push-pull circuit is for receiving at least one input signal and for producing an amplified output signal to drive the piezoelectric device.

Abstract: An acoustic system is described that includes a piezoelectric device; an alternating current (AC) power supply for supplying an AC voltage; an AC-to-direct current (DC) converter coupled to the AC power supply for converting the AC voltage supplied by the AC power supply into DC voltage; a function generator for producing an input signal at a resonant frequency of the piezoelectric device; and an amplifier coupled to the AC-to-DC converter, the function generator, and the piezoelectric device, where the amplifier is for producing an output signal by amplifying the input signal according to the DC voltage and driving the piezoelectric device using the output signal.

Abstract: An acoustic cleaving system are described for initiating and controlling crack propagation. In an embodiment, the system includes an acoustic generator that includes a piezoelectric device; a high-voltage power supply; and an acoustic cleaving circuit. The acoustic cleaving circuit includes a push-pull circuit coupled to the piezoelectric device and coupled to the high-voltage power supply, and a capacitor bank that includes one or more capacitors coupled in parallel to the push-pull circuit. In one embodiment, the push-pull circuit is for receiving at least one input signal and for producing an amplified output signal to drive the piezoelectric device.