Patents by Inventor Padma Gopalakrishnan

Padma Gopalakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10923379
    Abstract: An insulator-type substrate is positioned on a support surface of a substrate support structure in exposure to a plasma. An initial clamping voltage is applied to an electrode within the substrate support structure to rapidly accumulate electrical charge on the support surface to hold the substrate. A backside cooling gas is flowed to a region between the substrate and the support surface, and a leak rate of the backside cooling gas is monitored. A steady clamping voltage is applied to the electrode, and the steady clamping voltage is adjusted in a step-wise manner to maintain the monitored leak rate of the backside cooling gas at just less than a maximum allowable leak rate. Or, a pulsed clamping voltage is applied to the electrode, and the pulsed clamping voltage is adjusted to maintain the monitored leak rate of the backside cooling gas at just less than the maximum allowable leak rate.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: February 16, 2021
    Assignee: Lam Research Corporation
    Inventors: Chin-Yi Liu, Daniel Lai, Rajitha Vemuri, Padma Gopalakrishnan
  • Publication number: 20180233393
    Abstract: An insulator-type substrate is positioned on a support surface of a substrate support structure in exposure to a plasma. An initial clamping voltage is applied to an electrode within the substrate support structure to rapidly accumulate electrical charge on the support surface to hold the substrate. A backside cooling gas is flowed to a region between the substrate and the support surface, and a leak rate of the backside cooling gas is monitored. A steady clamping voltage is applied to the electrode, and the steady clamping voltage is adjusted in a step-wise manner to maintain the monitored leak rate of the backside cooling gas at just less than a maximum allowable leak rate. Or, a pulsed clamping voltage is applied to the electrode, and the pulsed clamping voltage is adjusted to maintain the monitored leak rate of the backside cooling gas at just less than the maximum allowable leak rate.
    Type: Application
    Filed: February 15, 2017
    Publication date: August 16, 2018
    Inventors: Chin-Yi Liu, Daniel Lai, Rajitha Vemuri, Padma Gopalakrishnan
  • Patent number: 9960019
    Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring body having a top planar surface and a bottom planar surface, and an outer ring body having a top surface, a bottom surface substantially parallel to the top surface, and an inside surface that extends between the top surface and the bottom surface, the inside surface having a roof covering a portion of the inner ring body when the inner ring body is disposed adjacent the roof, wherein the inner ring body can be flipped into a different position so that a portion of the inner ring body that is not covered by the roof provides a substantially planar surface.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: May 1, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Sandhya Arun, Prashanth Kodigepalli, Padma Gopalakrishnan, Ashish Bhatnagar, Dan Martin, Christopher Heath John Hossack
  • Patent number: 9481608
    Abstract: A method of fabricating a processing chamber component comprises forming a processing chamber component having a structural body with surface regions having microcracks, and directing a laser beam onto the microcracks of the surface regions of the structural body for a sufficient time to heal and close off the microcracks by themselves.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: November 1, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Ashish Bhatnagar, Laxman Murugesh, Padma Gopalakrishnan
  • Patent number: 9227297
    Abstract: A retaining ring includes a generally annular upper portion having a top surface configured to be connected to a base of a carrier head and a lower surface, and a plurality of substantially identical arcuate segments detachably secured to the upper portion to form an annular lower portion. Each of the arcuate segments has an upper surface that abuts the lower surface of the upper portion and a bottom surface for contacting a polishing pad during polishing.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: January 5, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Irfanulla Khuddus Rahmathullah, Bopanna Ichettira Vansantha, Padma Gopalakrishnan, Abraham Palaty, Aswathnarayanaiah Ravi, Ashish Bhatnagar, Young J. Paik, Stacy Meyer, Daniel Martin
  • Patent number: 9168631
    Abstract: A retaining ring includes an annular lower portion and an annular upper portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, an inner rim projecting upward from the main body, an outer rim projecting upward from the main body and separated from the inner rim by a gap, and a plurality of azimuthally separated interlock features positioned between the inner rim and the outer rim, each interlock feature projecting upwardly from the main body. The annular upper portion has a top surface and a bottom surface and a plurality of azimuthally separated recesses in the bottom surface, the recesses defining thin portions of the upper portion, the plurality of interlock features fitting into the plurality of recesses. The lower portion is a plastic and the upper portion is a material that is more rigid than the plastic.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: October 27, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Irfanulla Khuddus Rahmathullah, Bopanna Ichettira Vansantha, Padma Gopalakrishnan, Aswathnarayanaiah Ravi, Abraham Palaty, Young J. Paik, Stacy Meyer, James Klingler, Ashish Bhatnagar
  • Publication number: 20140287662
    Abstract: A retaining ring includes a generally annular upper portion having a top surface configured to be connected to a base of a carrier head and a lower surface, and a plurality of substantially identical arcuate segments detachably secured to the upper portion to form an annular lower portion. Each of the arcuate segments has an upper surface that abuts the lower surface of the upper portion and a bottom surface for contacting a polishing pad during polishing.
    Type: Application
    Filed: March 19, 2014
    Publication date: September 25, 2014
    Inventors: Irfanulla Khuddus Rahmathullah, Bopanna Ichettira Vansantha, Padma Gopalakrishnan, Abraham Palaty, Aswathnarayanaiah Ravi, Ashish Bhatnagar, Young J. Paik, Stacy Meyer, Daniel Martin
  • Publication number: 20140238604
    Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring body having a top planar surface and a bottom planar surface, and an outer ring body having a top surface, a bottom surface substantially parallel to the top surface, and an inside surface that extends between the top surface and the bottom surface, the inside surface having a roof covering a portion of the inner ring body when the inner ring body is disposed adjacent the roof, wherein the inner ring body can be flipped into a different position so that a portion of the inner ring body that is not covered by the roof provides a substantially planar surface.
    Type: Application
    Filed: May 6, 2014
    Publication date: August 28, 2014
    Inventors: Sandhya ARUN, Prashanth KODIGEPALLI, Padma GOPALAKRISHNAN, Ashish BHATNAGAR, Dan MARTIN, Christopher Heath John HOSSACK
  • Publication number: 20140167327
    Abstract: A method of fabricating a processing chamber component comprises forming a processing chamber component having a structural body with surface regions having microcracks, and directing a laser beam onto the microcracks of the surface regions of the structural body for a sufficient time to heal and close off the microcracks by themselves.
    Type: Application
    Filed: November 22, 2013
    Publication date: June 19, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Ashish BHATNAGAR, Laxman MURUGESH, Padma GOPALAKRISHNAN
  • Patent number: 8740206
    Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring and an outer ring disposed radially outward of the inner ring. The inner ring will correspond to the location where the majority of erosion occurs during use. This inner ring can be flipped and reused until both sides have eroded beyond their service life. Collectively, the two rings generally have the shape of a single piece ring, but the service life of the ring assembly is longer than a conventional single piece ring.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: June 3, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Sandhya Arun, Prashanth Kodigepalli, Padma Gopalakrishnan, Ashish Bhatnagar, Dan Martin, Christopher Heath John Hossack
  • Patent number: 8617672
    Abstract: A substrate processing chamber component has a structural body with localized surface regions having annealed microcracks. The annealed microcracks reduce crack propagation and increase fracture resistance. In one method of manufacture, the structural body of the component is formed, and a laser beam is directed onto localized surface regions of the body for a sufficient time to anneal the surface microcracks.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: December 31, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Ashish Bhatnagar, Laxman Murugesh, Padma Gopalakrishnan
  • Publication number: 20130324017
    Abstract: A retaining ring includes an annular lower portion and an annular upper portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, an inner rim projecting upward from the main body, an outer rim projecting upward from the main body and separated from the inner rim by a gap, and a plurality of azimuthally separated interlock features positioned between the inner rim and the outer rim, each interlock feature projecting upwardly from the main body. The annular upper portion has a top surface and a bottom surface and a plurality of azimuthally separated recesses in the bottom surface, the recesses defining thin portions of the upper portion, the plurality of interlock features fitting into the plurality of recesses. The lower portion is a plastic and the upper portion is a material that is more rigid than the plastic.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 5, 2013
    Inventors: Irfanulla Khuddus Rahmathullah, Bopanna Ichettira Vansantha, Padma Gopalakrishnan, Ravi Aswathnarayanaiah, Abraham Palaty, Young J. Paik, Stacy Meyer, James Klingler, Ashish Bhatnagar
  • Publication number: 20130035022
    Abstract: A retaining ring includes a generally annular lower portion and a generally annular upper portion. The lower portion has a bottom surface for contacting a polishing pad during polishing and a top surface. The upper portion has a bottom surface secured to the top surface of the lower portion and a top surface configured to be mechanically affixed to and abut a rigid base of a carrier head. The lower portion is a first plastic, and the upper portion is a different second plastic that is about the same or more rigid than the first plastic.
    Type: Application
    Filed: July 27, 2012
    Publication date: February 7, 2013
    Inventors: Young J. Paik, James Klingler, Stacy Meyer, Christopher R. Mahon, Laxman Murugesh, Ashish Bhatnagar, Padma Gopalakrishnan
  • Publication number: 20120154974
    Abstract: The present invention generally provides a high efficiency electrostatic chuck including a flex stack having an electrode disposed between two layers of dielectric material. At least one of the layers is a standard or high purity thermoplastic film. The flex stack may have a matte finish on the substrate supporting surface to provide benefits such as improved temperature distribution across the surface of the chuck. The non-substrate supporting or pedestal receiving side of the flex stack may be plasma treated to provide a desired surface finish, which is then bonded to a pedestal using an acrylic or epoxy adhesive resulting in superior bonding strength compared to traditional polymer electrostatic chucks. The electrode may be a sheet electrode on a release liner, which enables ease of manufacturing.
    Type: Application
    Filed: August 19, 2011
    Publication date: June 21, 2012
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Ashish Bhatnagar, Monika Agarwal, Padma Gopalakrishnan, Daniel Martin
  • Publication number: 20110180983
    Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring and an outer ring disposed radially outward of the inner ring. The inner ring will correspond to the location where the majority of erosion occurs during use. This inner ring can be flipped and reused until both sides have eroded beyond their service life. Collectively, the two rings generally have the shape of a single piece ring, but the service life of the ring assembly is longer than a conventional single piece ring.
    Type: Application
    Filed: January 25, 2011
    Publication date: July 28, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: SANDHYA ARUN, Prashanth Kodigepalli, Padma Gopalakrishnan, Ashish Bhatnagar, Dan Martin, Christopher Heath John Hossack
  • Publication number: 20070014949
    Abstract: A substrate processing chamber component has a structural body with localized surface regions having annealed microcracks. The annealed microcracks reduce crack propagation and increase fracture resistance. In one method of manufacture, the structural body of the component is formed by conventional means, and a laser beam is directed onto localized surface regions of the body for a sufficient time to anneal the surface microcracks.
    Type: Application
    Filed: July 13, 2005
    Publication date: January 18, 2007
    Inventors: Ashish Bhatnagar, Laxman Murugesh, Padma Gopalakrishnan