Patents by Inventor Padma Gopalakrishnan
Padma Gopalakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10923379Abstract: An insulator-type substrate is positioned on a support surface of a substrate support structure in exposure to a plasma. An initial clamping voltage is applied to an electrode within the substrate support structure to rapidly accumulate electrical charge on the support surface to hold the substrate. A backside cooling gas is flowed to a region between the substrate and the support surface, and a leak rate of the backside cooling gas is monitored. A steady clamping voltage is applied to the electrode, and the steady clamping voltage is adjusted in a step-wise manner to maintain the monitored leak rate of the backside cooling gas at just less than a maximum allowable leak rate. Or, a pulsed clamping voltage is applied to the electrode, and the pulsed clamping voltage is adjusted to maintain the monitored leak rate of the backside cooling gas at just less than the maximum allowable leak rate.Type: GrantFiled: February 15, 2017Date of Patent: February 16, 2021Assignee: Lam Research CorporationInventors: Chin-Yi Liu, Daniel Lai, Rajitha Vemuri, Padma Gopalakrishnan
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Publication number: 20180233393Abstract: An insulator-type substrate is positioned on a support surface of a substrate support structure in exposure to a plasma. An initial clamping voltage is applied to an electrode within the substrate support structure to rapidly accumulate electrical charge on the support surface to hold the substrate. A backside cooling gas is flowed to a region between the substrate and the support surface, and a leak rate of the backside cooling gas is monitored. A steady clamping voltage is applied to the electrode, and the steady clamping voltage is adjusted in a step-wise manner to maintain the monitored leak rate of the backside cooling gas at just less than a maximum allowable leak rate. Or, a pulsed clamping voltage is applied to the electrode, and the pulsed clamping voltage is adjusted to maintain the monitored leak rate of the backside cooling gas at just less than the maximum allowable leak rate.Type: ApplicationFiled: February 15, 2017Publication date: August 16, 2018Inventors: Chin-Yi Liu, Daniel Lai, Rajitha Vemuri, Padma Gopalakrishnan
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Patent number: 9960019Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring body having a top planar surface and a bottom planar surface, and an outer ring body having a top surface, a bottom surface substantially parallel to the top surface, and an inside surface that extends between the top surface and the bottom surface, the inside surface having a roof covering a portion of the inner ring body when the inner ring body is disposed adjacent the roof, wherein the inner ring body can be flipped into a different position so that a portion of the inner ring body that is not covered by the roof provides a substantially planar surface.Type: GrantFiled: May 6, 2014Date of Patent: May 1, 2018Assignee: Applied Materials, Inc.Inventors: Sandhya Arun, Prashanth Kodigepalli, Padma Gopalakrishnan, Ashish Bhatnagar, Dan Martin, Christopher Heath John Hossack
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Patent number: 9481608Abstract: A method of fabricating a processing chamber component comprises forming a processing chamber component having a structural body with surface regions having microcracks, and directing a laser beam onto the microcracks of the surface regions of the structural body for a sufficient time to heal and close off the microcracks by themselves.Type: GrantFiled: November 22, 2013Date of Patent: November 1, 2016Assignee: Applied Materials, Inc.Inventors: Ashish Bhatnagar, Laxman Murugesh, Padma Gopalakrishnan
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Patent number: 9227297Abstract: A retaining ring includes a generally annular upper portion having a top surface configured to be connected to a base of a carrier head and a lower surface, and a plurality of substantially identical arcuate segments detachably secured to the upper portion to form an annular lower portion. Each of the arcuate segments has an upper surface that abuts the lower surface of the upper portion and a bottom surface for contacting a polishing pad during polishing.Type: GrantFiled: March 19, 2014Date of Patent: January 5, 2016Assignee: Applied Materials, Inc.Inventors: Irfanulla Khuddus Rahmathullah, Bopanna Ichettira Vansantha, Padma Gopalakrishnan, Abraham Palaty, Aswathnarayanaiah Ravi, Ashish Bhatnagar, Young J. Paik, Stacy Meyer, Daniel Martin
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Patent number: 9168631Abstract: A retaining ring includes an annular lower portion and an annular upper portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, an inner rim projecting upward from the main body, an outer rim projecting upward from the main body and separated from the inner rim by a gap, and a plurality of azimuthally separated interlock features positioned between the inner rim and the outer rim, each interlock feature projecting upwardly from the main body. The annular upper portion has a top surface and a bottom surface and a plurality of azimuthally separated recesses in the bottom surface, the recesses defining thin portions of the upper portion, the plurality of interlock features fitting into the plurality of recesses. The lower portion is a plastic and the upper portion is a material that is more rigid than the plastic.Type: GrantFiled: May 31, 2013Date of Patent: October 27, 2015Assignee: Applied Materials, Inc.Inventors: Irfanulla Khuddus Rahmathullah, Bopanna Ichettira Vansantha, Padma Gopalakrishnan, Aswathnarayanaiah Ravi, Abraham Palaty, Young J. Paik, Stacy Meyer, James Klingler, Ashish Bhatnagar
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Publication number: 20140287662Abstract: A retaining ring includes a generally annular upper portion having a top surface configured to be connected to a base of a carrier head and a lower surface, and a plurality of substantially identical arcuate segments detachably secured to the upper portion to form an annular lower portion. Each of the arcuate segments has an upper surface that abuts the lower surface of the upper portion and a bottom surface for contacting a polishing pad during polishing.Type: ApplicationFiled: March 19, 2014Publication date: September 25, 2014Inventors: Irfanulla Khuddus Rahmathullah, Bopanna Ichettira Vansantha, Padma Gopalakrishnan, Abraham Palaty, Aswathnarayanaiah Ravi, Ashish Bhatnagar, Young J. Paik, Stacy Meyer, Daniel Martin
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Publication number: 20140238604Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring body having a top planar surface and a bottom planar surface, and an outer ring body having a top surface, a bottom surface substantially parallel to the top surface, and an inside surface that extends between the top surface and the bottom surface, the inside surface having a roof covering a portion of the inner ring body when the inner ring body is disposed adjacent the roof, wherein the inner ring body can be flipped into a different position so that a portion of the inner ring body that is not covered by the roof provides a substantially planar surface.Type: ApplicationFiled: May 6, 2014Publication date: August 28, 2014Inventors: Sandhya ARUN, Prashanth KODIGEPALLI, Padma GOPALAKRISHNAN, Ashish BHATNAGAR, Dan MARTIN, Christopher Heath John HOSSACK
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Publication number: 20140167327Abstract: A method of fabricating a processing chamber component comprises forming a processing chamber component having a structural body with surface regions having microcracks, and directing a laser beam onto the microcracks of the surface regions of the structural body for a sufficient time to heal and close off the microcracks by themselves.Type: ApplicationFiled: November 22, 2013Publication date: June 19, 2014Applicant: Applied Materials, Inc.Inventors: Ashish BHATNAGAR, Laxman MURUGESH, Padma GOPALAKRISHNAN
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Patent number: 8740206Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring and an outer ring disposed radially outward of the inner ring. The inner ring will correspond to the location where the majority of erosion occurs during use. This inner ring can be flipped and reused until both sides have eroded beyond their service life. Collectively, the two rings generally have the shape of a single piece ring, but the service life of the ring assembly is longer than a conventional single piece ring.Type: GrantFiled: January 25, 2011Date of Patent: June 3, 2014Assignee: Applied Materials, Inc.Inventors: Sandhya Arun, Prashanth Kodigepalli, Padma Gopalakrishnan, Ashish Bhatnagar, Dan Martin, Christopher Heath John Hossack
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Patent number: 8617672Abstract: A substrate processing chamber component has a structural body with localized surface regions having annealed microcracks. The annealed microcracks reduce crack propagation and increase fracture resistance. In one method of manufacture, the structural body of the component is formed, and a laser beam is directed onto localized surface regions of the body for a sufficient time to anneal the surface microcracks.Type: GrantFiled: July 13, 2005Date of Patent: December 31, 2013Assignee: Applied Materials, Inc.Inventors: Ashish Bhatnagar, Laxman Murugesh, Padma Gopalakrishnan
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Publication number: 20130324017Abstract: A retaining ring includes an annular lower portion and an annular upper portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, an inner rim projecting upward from the main body, an outer rim projecting upward from the main body and separated from the inner rim by a gap, and a plurality of azimuthally separated interlock features positioned between the inner rim and the outer rim, each interlock feature projecting upwardly from the main body. The annular upper portion has a top surface and a bottom surface and a plurality of azimuthally separated recesses in the bottom surface, the recesses defining thin portions of the upper portion, the plurality of interlock features fitting into the plurality of recesses. The lower portion is a plastic and the upper portion is a material that is more rigid than the plastic.Type: ApplicationFiled: May 31, 2013Publication date: December 5, 2013Inventors: Irfanulla Khuddus Rahmathullah, Bopanna Ichettira Vansantha, Padma Gopalakrishnan, Ravi Aswathnarayanaiah, Abraham Palaty, Young J. Paik, Stacy Meyer, James Klingler, Ashish Bhatnagar
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Publication number: 20130035022Abstract: A retaining ring includes a generally annular lower portion and a generally annular upper portion. The lower portion has a bottom surface for contacting a polishing pad during polishing and a top surface. The upper portion has a bottom surface secured to the top surface of the lower portion and a top surface configured to be mechanically affixed to and abut a rigid base of a carrier head. The lower portion is a first plastic, and the upper portion is a different second plastic that is about the same or more rigid than the first plastic.Type: ApplicationFiled: July 27, 2012Publication date: February 7, 2013Inventors: Young J. Paik, James Klingler, Stacy Meyer, Christopher R. Mahon, Laxman Murugesh, Ashish Bhatnagar, Padma Gopalakrishnan
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Publication number: 20120154974Abstract: The present invention generally provides a high efficiency electrostatic chuck including a flex stack having an electrode disposed between two layers of dielectric material. At least one of the layers is a standard or high purity thermoplastic film. The flex stack may have a matte finish on the substrate supporting surface to provide benefits such as improved temperature distribution across the surface of the chuck. The non-substrate supporting or pedestal receiving side of the flex stack may be plasma treated to provide a desired surface finish, which is then bonded to a pedestal using an acrylic or epoxy adhesive resulting in superior bonding strength compared to traditional polymer electrostatic chucks. The electrode may be a sheet electrode on a release liner, which enables ease of manufacturing.Type: ApplicationFiled: August 19, 2011Publication date: June 21, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Ashish Bhatnagar, Monika Agarwal, Padma Gopalakrishnan, Daniel Martin
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Publication number: 20110180983Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring and an outer ring disposed radially outward of the inner ring. The inner ring will correspond to the location where the majority of erosion occurs during use. This inner ring can be flipped and reused until both sides have eroded beyond their service life. Collectively, the two rings generally have the shape of a single piece ring, but the service life of the ring assembly is longer than a conventional single piece ring.Type: ApplicationFiled: January 25, 2011Publication date: July 28, 2011Applicant: APPLIED MATERIALS, INC.Inventors: SANDHYA ARUN, Prashanth Kodigepalli, Padma Gopalakrishnan, Ashish Bhatnagar, Dan Martin, Christopher Heath John Hossack
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Publication number: 20070014949Abstract: A substrate processing chamber component has a structural body with localized surface regions having annealed microcracks. The annealed microcracks reduce crack propagation and increase fracture resistance. In one method of manufacture, the structural body of the component is formed by conventional means, and a laser beam is directed onto localized surface regions of the body for a sufficient time to anneal the surface microcracks.Type: ApplicationFiled: July 13, 2005Publication date: January 18, 2007Inventors: Ashish Bhatnagar, Laxman Murugesh, Padma Gopalakrishnan