Abstract: The present invention provides a photomask inspection method, including steps of defining an anchor ratio, providing a photomask and measuring the photomask to obtain a measured ratio, wherein the measured ratio is equal to a value of an image intensity extremum divided by an image intensity threshold or is equal to a value of the image intensity threshold divided by the image intensity extremum when the photomask is measured in an image measurement system tool for a specific critical dimension, and if the measured ratio is larger than the anchor ratio, the photomask is regarded as passing the inspection, and if the measured ratio is smaller than the anchor ratio, the photomask is regarded as failing the inspection.

Abstract: A manufacturing method of a semiconductor device includes the following steps. Trenches are formed on a substrate, and the trenches are formed on a first region and a second region defined on the substrate. A barrier layer is formed conformally in the trenches. A first pull-down process is performed to the barrier layer on the second region. The barrier layer on the first region is covered by a first mask during the first pull-down process. A second pull-down process is performed to the barrier layer on the first region. The barrier layer on the second region is covered by a second mask during the second pull-down process. A proportion of an area of the trenches on the first region to an area of the first region is different from a proportion of an area of the trenches on the second region to an area of the second region.

Abstract: An image capturing apparatus including a light guide device having a first surface and a second surface opposite to each other, a transparent device disposed on the first surface, an image capturing device disposed on the second surface, a first optical adhesive, a second optical adhesive and a light source is provided. The first optical adhesive is disposed between the transparent device and the first surface. The transparent device is connected to the first surface through the first optical adhesive. The second optical adhesive is disposed between the second surface and the image capturing device. The image capturing device is connected to the second surface through the second optical adhesive. The light source is adapted to emit a light beam. The light beam passed through the light guide device is transmitted toward the transparent device and totally reflected by an interface between the transparent device and an environment medium.

Abstract: An image capturing apparatus including a light guide device having a first surface and a second surface opposite to each other, a transparent device disposed on the first surface, an image capturing device disposed on the second surface, a first optical adhesive, a second optical adhesive and a light source is provided. The first optical adhesive is disposed between the transparent device and the first surface. The transparent device is connected to the first surface through the first optical adhesive. The second optical adhesive is disposed between the second surface and the image capturing device. The image capturing device is connected to the second surface through the second optical adhesive. The light source is adapted to emit a light beam. The light beam passed through the light guide device is transmitted toward the transparent device and totally reflected by an interface between the transparent device and an environment medium.