Patents by Inventor PAI-CHIA KUO

PAI-CHIA KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • On-chip thin film Zernike phase plate and applications thereof
    Patent number: 8791416
    Abstract: The present invention provides an on-chip thin film phase plate for a releasing charging, comprising a chip substrate having one or more apertures; and a thin film layer attached to the top surface of the chip substrate. The present invention also provides a method for observing organic material by TEM, which uses the above-mentioned on-chip thin film phase plate in a TEM system.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: July 29, 2014
    Assignee: Academia Sinica
    Inventors: Yunn-Shin Shiue, Pai-Chia Kuo, Chih-Ting Chen, Yuh-Lin Wang, Yong-Fen Hsieh
  • ON-CHIP THIN FILM ZERNIKE PHASE PLATE AND APPLICATIONS THEREOF
    Publication number: 20140166880
    Abstract: The present invention provides an on-chip thin film phase plate for a releasing charging, comprising a chip substrate having one or more apertures; and a thin film layer attached to the top surface of the chip substrate. The present invention also provides a method for observing organic material by TEM, which uses the above-mentioned on-chip thin film phase plate in a TEM system.
    Type: Application
    Filed: December 16, 2013
    Publication date: June 19, 2014
    Applicant: ACADEMIA SINICA
    Inventors: YUNN-SHIN SHIUE, PAI-CHIA KUO, CHIH-TING CHEN, YUH-LIN WANG, YONG-FEN HSIEH