Patents by Inventor Pai-Lee CHANG

Pai-Lee CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10090575
    Abstract: The present invention provides a method of manufacturing a waveguide assembly and a structure thereof, wherein the manufacturing method comprises the steps of: providing at least two waveguide units and combining the waveguide units, wherein each waveguide unit has at least one bonding portion formed at a position where each two said waveguide units are combined; and at least one adhesive is applied to the bonding portion to combine the waveguide units into the waveguide assembly. With the practice of the present invention, many advanced functions such as rapid design, rapid manufacture, rapid verification and cost reduction can be achieved.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: October 2, 2018
    Assignees: Tenn Vac Inc., TennMax America Inc.
    Inventors: Pai-Lee Chang, Guan-Yu Chen
  • Publication number: 20180151935
    Abstract: The present invention provides a method of manufacturing a waveguide assembly and a structure thereof, wherein the manufacturing method comprises the steps of: providing at least two waveguide units and combining the waveguide units, wherein each waveguide unit has at least one bonding portion formed at a position where each two said waveguide units are combined; and at least one adhesive is applied to the bonding portion to combine the waveguide units into the waveguide assembly. With the practice of the present invention, many advanced functions such as rapid design, rapid manufacture, rapid verification and cost reduction can be achieved.
    Type: Application
    Filed: February 10, 2017
    Publication date: May 31, 2018
    Inventors: Pai-Lee CHANG, Guan-Yu CHEN
  • Publication number: 20170202116
    Abstract: The present invention provides a method for reducing gap in gasket filling, comprising the steps of: providing a structure; forming a fillet; and performing gasket filling, wherein, the fillet in a round corner form is formed at the starting point or the end point of the gasket filling path. With the present invention, the gasket filled at the two ends of the gasket filling path, namely the starting point and the end point of the gasket filling path, would not form a gap between the gasket and the structure, can effectively prevent water or debris from entering into the structure, and when the gasket used is a conductive gasket, electro-magnetic interference (EMI) is perfectly shielded from entering into or radiating out of the structure.
    Type: Application
    Filed: April 4, 2016
    Publication date: July 13, 2017
    Inventor: Pai-Lee CHANG