Abstract: A composite light-emitting-diode (LED) packaging structure includes an upper LED package structure and a lower LED package structure packaged integrally together. The upper LED package structure includes an upper substrate having a hollow structure and an upper LED transparent chip in the hollow structure and enclosed from top to bottom by a light transmitting filling material. The lower LED package structure includes a lower substrate and a lower LED transparent chip on the lower substrate, packaged in the hollow structure and having a light transmitting protection layer.

Abstract: A composite light-emitting-diode (LED) packaging structure having oppositely arranged chips comprises a first substrate with a first surface and a second surface, a second substrate with a first surface and a second surface, a first LED chip on the first surface of the first substrate, and a second LED chip on the first surface of the second substrate. The second surface of the second substrate and the second surface of the first substrate are packaged integrally in contact.