Patents by Inventor Pai LU

Pai LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Deposited carbon film on etched silicon for on-chip supercapacitor
    Patent number: 12033796
    Abstract: An on-chip supercapacitor constituted by a silicon substrate and a porous carbon layer positioned thereon, the carbon layer including pseudocapacitive materials. The invention also relates to the method for producing the supercapacitor and the porous material.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: July 9, 2024
    Assignee: University of South-Eastern Norway
    Inventors: Pai Lu, Xuyuan Chen
  • On-chip supercapacitor with silicon nanostructure
    Patent number: 11101082
    Abstract: An on-chip supercapacitor has an electrode that includes one-dimensional silicon nano structures coated with a first layer of titanium nitride. The on-chip supercapacitor also includes a second layer of manganese dioxide deposited on the first layer. An associated method of providing an on-chip supercapacitor electrode on a silicon substrate includes providing a plurality of one-dimensional silicon nanostructures on a substrate, coating the one-dimensional silicon nanostructures with a first layer of titanium nitride, and coating a second layer of manganese dioxide onto the first layer.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: August 24, 2021
    Assignee: University of South-Eastern Norway
    Inventors: Xuyuan Chen, Pai Lu, Per Alfred Øhlckers
  • ON-CHIP SUPERCAPACITOR WITH SILICON NANOSTRUCTURE
    Publication number: 20200035420
    Abstract: An on-chip supercapacitor having an electrode comprising one-dimensional silicon (Si) nanostructures (3) coated with a first layer (10) of titanium nitride (TiN). It further comprises a second layer (20) of manganese dioxide (MnO2) deposited on the first layer. An associated method is also disclosed.
    Type: Application
    Filed: March 6, 2018
    Publication date: January 30, 2020
    Applicant: University of South-Eastern Norway
    Inventors: Xuyuan CHEN, Pai LU, Per Alfred ØHLCKERS
  • DEPOSITED CARBON FILM ON ETCHED SILICON FOR ON-CHIP SUPERCAPACITOR
    Publication number: 20200013560
    Abstract: An on-chip supercapacitor constituted by a silicon substrate and a porous carbon layer positioned thereon, the carbon layer including pseudocapacitive materials. The invention also relates to the method for producing the supercapacitor and the porous material.
    Type: Application
    Filed: March 7, 2018
    Publication date: January 9, 2020
    Applicant: University of South-Eastern Norway
    Inventors: Pai LU, Xuyuan CHEN