Patents by Inventor Pai R. Rajendra

Pai R. Rajendra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical connection assembly and electrical apparatus
    Patent number: 11271338
    Abstract: An electrical connection assembly includes a circuit board and a connector mounted on the circuit board. The connector has a housing and a contact received in the housing. The contact has an elastic arm extending out from a surface of the housing and a connection pin extending out from a side face of the housing. The elastic arm electrically contacts an electrical contact pad on a moving bracket and the connection pin electrically contacts the circuit board.
    Type: Grant
    Filed: April 25, 2020
    Date of Patent: March 8, 2022
    Assignees: Tyco Electronics Japan G.K., Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Ken Sakai, Pai R. Rajendra, Yulin Feng, Lei Pan, Tian Xia
  • Electrical Connection Assembly And Electrical Apparatus
    Publication number: 20200343664
    Abstract: An electrical connection assembly includes a circuit board and a connector mounted on the circuit board. The connector has a housing and a contact received in the housing. The contact has an elastic arm extending out from a surface of the housing and a connection pin extending out from a side face of the housing. The elastic arm electrically contacts an electrical contact pad on a moving bracket and the connection pin electrically contacts the circuit board.
    Type: Application
    Filed: April 25, 2020
    Publication date: October 29, 2020
    Applicants: Tyco Electronics Japan G.K., Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Ken Sakai, Pai R. Rajendra, Yulin Feng, Lei Pan, Tian Xia