Patents by Inventor Pai-Yi Huang

Pai-Yi Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240314970
    Abstract: This disclosure relates to an adjustable heat source simulation assembly includes at least one first simulation heater, a second simulation heater and a power output module. The at least one first simulation heater and the second simulation heater are configured to be disposed in a server chassis. The power output module is electrically connected to the at least one first simulation heater and the second simulation heater so as to control heating power of the at least one first simulation heater and the second simulation heater.
    Type: Application
    Filed: June 13, 2023
    Publication date: September 19, 2024
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Han-Chih HSIEH, Pai-Yi HUANG
  • Publication number: 20080313902
    Abstract: A method for fabricating a heat-dissipating base structure is disclosed.
    Type: Application
    Filed: June 20, 2007
    Publication date: December 25, 2008
    Applicant: Inventec Corporation
    Inventor: Pai-Yi Huang
  • Publication number: 20080277107
    Abstract: A heat dissipating base structure includes a base; a plurality of heat dissipating fins disposed on the base and arranged in parallel to each other, each of the heat dissipating fins being formed with at least a first through hole and a second through hole corresponding to the first through hole; and at least a U-shaped heat pipe having a bending portion and two pipe leg portions extending from two ends of the bending portion respectively. The cross section of the pipe leg portions is smaller than the size of the first and second through holes. Each of the pipe leg portions is fixedly disposed in the first and second through holes at one side thereof respectively, and can move freely in the holes before being fixedly disposed.
    Type: Application
    Filed: May 7, 2007
    Publication date: November 13, 2008
    Applicant: Inventec Corporation
    Inventor: Pai-Yi Huang