Abstract: An electronic apparatus and an electronic system may include a first power delivery network (PDN) and a second PDN. The first PDN may include a first inductor as a segment of a power rail of the first PDN, while the second PDN may include a second inductor as a segment of a power rail of the second PDN. The first inductor and the second inductor may form a magnetically coupled inductor. The magnetically coupled inductor may provide migrated impedance ZT to the first PDN induced by the magnetically coupled inductor. The migrated impedance ZT to the first PDN may help the first PDN to reduce its voltage noise. Other embodiments may be described and/or claimed.

Abstract: Ring-in-ring stiffeners on a semiconductor package substrate includes a passive device that is seated across the ring stiffeners. The ring-in-ring stiffeners are also electrically coupled to traces in the semiconductor package substrate through electrically conductive adhesive that bonds a given ring stiffener to the semiconductor package substrate. The passive device is embedded between the two ring stiffeners to create a smaller X-Y footprint as well as a lower Z-direction profile.

Abstract: Ring-in-ring stiffeners on a semiconductor package substrate includes a passive device that is seated across the ring stiffeners. The ring-in-ring stiffeners are also electrically coupled to traces in the semiconductor package substrate through electrically conductive adhesive that bonds a given ring stiffener to the semiconductor package substrate. The passive device is embedded between the two ring stiffeners to create a smaller X-Y footprint as well as a lower Z-direction profile.

Abstract: A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful compositions as well as shapes and sizes.

Abstract: An electronic apparatus and an electronic system may include a first power delivery network (PDN) and a second PDN. The first PDN may include a first inductor as a segment of a power rail of the first PDN, while the second PDN may include a second inductor as a segment of a power rail of the second PDN. The first inductor and the second inductor may form a magnetically coupled inductor. The magnetically coupled inductor may provide migrated impedance ZT to the first PDN induced by the magnetically coupled inductor. The migrated impedance ZT to the first PDN may help the first PDN to reduce its voltage noise. Other embodiments may be described and/or claimed.

Abstract: Ring-in-ring stiffeners on a semiconductor package substrate includes a passive device that is seated across the ring stiffeners. The ring-in-ring stiffeners are also electrically coupled to traces in the semiconductor package substrate through electrically conductive adhesive that bonds a given ring stiffener to the semiconductor package substrate. The passive device is embedded between the two ring stiffeners to create a smaller X-Y footprint as well as a lower Z-direction profile.

Abstract: A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful compositions as well as shapes and sizes.

Abstract: Ring-in-ring stiffeners on a semiconductor package substrate includes a passive device that is seated across the ring stiffeners. The ring-in-ring stiffeners are also electrically coupled to traces in the semiconductor package substrate through electrically conductive adhesive that bonds a given ring stiffener to the semiconductor package substrate. The passive device is embedded between the two ring stiffeners to create a smaller X-Y footprint as well as a lower Z-direction profile.

Abstract: A semiconductor package is disclosed. The semiconductor package includes a multilayer package substrate. The layers of the multi-layer substrate include one or more conductive layers to transmit information within the semiconductor package. The layers also include one or more conductive power supply layers to provide power to the semiconductor package and to one or more connected components. The layers also include one or more layers of dielectric material forming a substrate core dielectric. The layers also include an embedded reference plane within the substrate core dielectric, wherein the embedded reference plane is conductive and reduces electrical interference between the other conductive layers in the multilayer package substrate.