Abstract: A die bond head apparatus has a die bond head body coupled to a die bond head motion table, a die holder motion table mounted on the die bond head body and a die holder which is operative in use to secure a semiconductor die to a substrate. The die holder is positionable by the die holder motion table independently of the die bond head motion table.

Abstract: A die bond head apparatus has a die bond head body coupled to a die bond head motion table, a die holder motion table mounted on the die bond head body and a die holder which is operative in use to secure a semiconductor die to a substrate. The die holder is positionable by the die holder motion table independently of the die bond head motion table.

Abstract: A cooling apparatus is provided for a bond head which has a collet to hold a semiconductor die and a heater to heat the semiconductor die held by the collet. The cooling apparatus includes a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle sprays a liquid-gas mixture of the dielectric liquid and the gas towards the surface of the heater.

Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Abstract: A bond head comprises an insulation block, a heater plate attached to the insulation block and a collet located on the heater plate for holding a semiconductor device. The heater plate is operative to heat the semiconductor device that is held by the collet. A flow generation plate that is detachably mounted between the insulation block and the heater plate is configured to direct cooling gas from the insulation block onto the heater plate so as to rapidly cool the heater plate.

Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Abstract: A cooling apparatus is provided for a bond head which has a collet adapted to hold a semiconductor die and a heater which is adapted to heat the semiconductor die held by the collet. The cooling apparatus comprises a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is operatively connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle is operative to spray a liquid-gas mixture comprising the dielectric liquid and the gas towards the surface of the heater.

Abstract: A bond head for thermal compression die bonding comprises a collet operative to support a die on a first side of the collet during die bonding and a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die. A die vacuum suction hole on the bond head heater applies a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater applies a vacuum suction force to hold the die. At least one vacuum distribution channel that is formed on the second side of the collet is in fluid communication with the collet vacuum suction hole and distributes the vacuum suction force across a surface of the second side of the collet for securing the collet.

Abstract: A bond head comprises an insulation block, a heater plate attached to the insulation block and a collet located on the heater plate for holding a semiconductor device. The heater plate is operative to heat the semiconductor device that is held by the collet. A flow generation plate that is detachably mounted between the insulation block and the heater plate is configured to direct cooling gas from the insulation block onto the heater plate so as to rapidly cool the heater plate.

Abstract: A bond head for thermal compression die bonding comprises a collet operative to support a die on a first side of the collet during die bonding and a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die. A die vacuum suction hole on the bond head heater applies a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater applies a vacuum suction force to hold the die. At least one vacuum distribution channel that is formed on the second side of the collet is in fluid communication with the collet vacuum suction hole and distributes the vacuum suction force across a surface of the second side of the collet for securing the collet.

Abstract: A linear motor comprising a coil assembly and a magnet assembly is provided with a cooling apparatus which comprises a segmented air knife assembly. The segmented air knife assembly has a plurality of slot openings distributed along its length which is coupled to the linear motor and it is operative to discharge cooling air into a gap between the coil assembly and magnet assembly in a discharge direction. An inclined surface extends from the plurality of slot openings and slopes at an obtuse angle away from the discharge direction of the cooling air. Each slot opening is individually configured to discharge the cooling air in the discharge direction at a sufficient velocity so as to entrain atmospheric air along the inclined surface to amplify the cooling air that is so discharged.

Abstract: A linear motor comprising a coil assembly and a magnet assembly is provided with a cooling apparatus which comprises a segmented air knife assembly. The segmented air knife assembly has a plurality of slot openings distributed along its length which is coupled to the linear motor and it is operative to discharge cooling air into a gap between the coil assembly and magnet assembly in a discharge direction. An inclined surface extends from the plurality of slot openings and slopes at an obtuse angle away from the discharge direction of the cooling air. Each slot opening is individually configured to discharge the cooling air in the discharge direction at a sufficient velocity so as to entrain atmospheric air along the inclined surface to amplify the cooling air that is so discharged.