Abstract: An integrated circuit having a metal interconnect layer, and also having a conductive line and a boundary defined with a uniform distance from the conductive line that defines a “keep out” distance between the boundary and the conductive line. A set of first fill elements are uniformly arranged along the boundary outside of the “keep out” distance, and a set of second fill elements further from the conductive line than the first fill elements are arranged in a pattern that would be uniform, but for having some fill elements missing from the pattern.

Abstract: Computer readable media hosting a layout description of electric circuitry that includes a description of prospective fill units and includes characteristic data noting at least one characteristic of each fill unit. In one preferred embodiment, each prospective fill unit includes just a single prospective fill element. Also, in a preferred embodiment, said characteristic data includes effect on electrical characteristics of nearby electrical circuitry. These electrical characteristics may further include timing characteristics and capacitance characteristics. The effect on the thickness of nearby connective elements also may be noted.