Abstract: A recycled polishing pad includes an upper layer pad and a supplementary pad. The upper layer pad includes a first surface and a second surface opposite to the first surface. The first surface has a plurality of first grooves and the second surface has a plurality of second grooves. The upper layer pad further includes a connecting body connecting the first grooves and the second grooves. The supplementary pad is in contact with the second surface of the upper layer pad. A depth of each of the first grooves is less than a depth of each of the second grooves.

Abstract: A recycled polishing pad includes an upper layer pad and a supplementary pad. The upper layer pad includes a first surface and a second surface opposite to the first surface. The first surface has a plurality of first grooves and the second surface has a plurality of second grooves. The upper layer pad further includes a connecting body connecting the first grooves and the second grooves. The supplementary pad is in contact with the second surface of the upper layer pad. A depth of each of the first grooves is less than a depth of each of the second grooves.

Abstract: The present disclosure relates to a porous polishing pad including pores by carbon dioxide gas generated by a reaction between a prepolymer and a hydrophilic polymer, and a method of preparing the porous polishing pad.

Abstract: The present disclosure relates to a porous polishing pad including pores formed by a reaction between a prepolymer and a saccharide material, and a method of preparing the porous polishing pad.

Abstract: The present disclosure relates to a porous polishing pad including pores by carbon dioxide gas generated by a reaction between a prepolymer and a hydrophilic polymer, and a method of preparing the porous polishing pad.

Abstract: An etching apparatus of a glass substrate for a flat panel display includes an etching chamber configured to receive a jig, glass substrates disposed on the jig, a holding member connected to the jig to hold the glass substrates, a transferring line connected to the jig to transfer the jig into the etching chamber, and a spray member which sprays an etchant onto surfaces of the glass substrates. A spray pressure of the etchant is equal to or greater than approximately 0.1 kg/cm2 and is less than approximately 0.5 kg/cm2.

Abstract: A substrate processing apparatus includes a process chamber, a fixed frame, a feed unit, and a supplying unit. A substrate is mounted to the fixed frame, the supplying unit is spaced apart from respective sides of the substrate to supply process fluid to the substrate, and the feed unit transports the fixed frame parallel to a longitudinal direction of the substrate. The process is automatically performed so that loss of the substrate is reduced and the substrate is effectively processed.