Abstract: A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.

Abstract: A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.

Abstract: Example apparatuses and systems for a combined temperature and pressure sensing device with improved electronic protection are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

Abstract: Example methods, apparatuses and systems for a combined temperature and pressure sensing device are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

Abstract: Example apparatuses and systems for a combined temperature and pressure sensing device with improved electronic protection are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

Abstract: A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.

Abstract: A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.

Abstract: Methods and apparatuses related to freeze resistant sensing assemblies are provided. An example pressure sensing assembly may include: a first member defining an aperture, the aperture comprising an inner opening disposed on an inner surface of the first member and an outer opening disposed on an outer surface of the first member; a protection diaphragm disposed on the inner surface of the first member; and a sensing diaphragm disposed in a second member fastened to the first member.

Abstract: Example methods, apparatuses and systems for a combined temperature and pressure sensing device are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

Abstract: Methods, apparatuses and systems for providing pressure sensing components for apparatuses are disclosed herein. An example pressure sensing component may comprise: a pressure sensing element defining a microfluidic channel containing a pressure transfer fluid configured to absorb a pressure of a media applied to the pressure sensing element, wherein at least one dimension of the microfluidic channel is in a micrometer range; and a pressure measuring element in electronic communication with the pressure sensing element, wherein the pressure measuring element is configured to convert a pressure of a media absorbed by the pressure sensing element into a measurable electrical signal.

Abstract: Methods and apparatuses related to freeze resistant sensing assemblies are provided. An example pressure sensing assembly may include: a first member defining an aperture, the aperture comprising an inner opening disposed on an inner surface of the first member and an outer opening disposed on an outer surface of the first member; a protection diaphragm disposed on the inner surface of the first member; and a sensing diaphragm disposed in a second member fastened to the first member.

Abstract: A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.

Abstract: A circulatory system monitor may include a sensor array having a plurality of sensor assemblies and a controller in communication with the sensor array. The sensor array may be configured to be pressed against a patient's body and the controller may identify a sensor assembly of the plurality of sensor assemblies from which a signal is to be used to determine a circulatory system parameter of the patient's body. The controller may use a signal from the identified sensor assembly to determine the circulatory system parameter. The circulatory system monitor may include an inflatable member and a pump. The configuration of the sensor array and the inflatable member may facilitate ensuring alignment of at last one sensor assembly of the sensor array with a target artery to be monitored.

Abstract: Embodiments relate generally to methods and systems for detecting pressure. A pressure sensor assembly may comprise a sensor unit having a pressure input port on one side, the sensor unit comprising a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port, wherein the media isolation layer is configured to transfer a pressure caused by a sense media to the pressure sensor.

Abstract: Embodiments relate generally to methods and systems for detecting pressure. A pressure sensor assembly may comprise a sensor unit having a pressure input port on one side, the sensor unit comprising a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port, wherein the media isolation layer is configured to transfer a pressure caused by a sense media to the pressure sensor.

Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.

Abstract: A force sensor may include a sense die mounted to a substrate and an actuating assembly for transmitting an external force to the sense die. The sense die may include a diaphragm, a boss extending from the diaphragm, and one or more sensing elements (e.g., piezoresistive elements positioned on the diaphragm). The actuation assembly may include a force receiving feature configured to receive an external force at a first end and transfer at least a portion of the received external force through a second end to the diaphragm via intimate contact with a bottom side of the boss. In some cases, the force sensor may also include signal conditioning circuitry.

Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cable harness assembly for connection with a sensor assembly may include a cable cover having a first end and a second end, a cable extending through an opening in the first end of the of the cable cover, and a crimp ring configured to engage the cable at a position within the cable cover, such that the attached crimp ring may not fit through the opening. The second end of the cable cover may be configured to connect to a housing of an electrical connector. Further, the cable may have wires that may be configured to electrically connect to electrical terminals of the electrical connector. In some instances, the electrical connector may be electrically connected to a sensor.

Abstract: A force sensor may include a sense die mounted to a substrate and an actuating assembly for transmitting an external force to the sense die. The sense die may include a diaphragm, a boss extending from the diaphragm, and one or more sensing elements (e.g., piezoresistive elements positioned on the diaphragm). The actuation assembly may include a force receiving feature configured to receive an external force at a first end and transfer at least a portion of the received external force through a second end to the diaphragm via intimate contact with a bottom side of the boss. In some cases, the force sensor may also include signal conditioning circuitry.

Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some illustrative cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In one example, the sensor unit may include a carrier carrying a sense element, where the carrier may extend into a recess of the pressure port and may be secured to the pressure port at an internal side thereof through the use of an adhesive layer.