Abstract: An optical package for use with a laser diode in high speed applications. The package comprises a metallic housing with a multilayer ceramic (MLC) insert disposed through a sidewall thereof. The MLC insert is utilized to form a microstrip transmission line of a bandwidth sufficient to couple a high frequency signal source to the laser. A number of conductive vias are disposed through the thickness of the MLC insert at the package wall to serve as electric field shorts within the insert and improve the frequency response of the microstrip. A pair of such MLC inserts may be disposed through opposing sidewalls of the package and used to provide a conventional "butterfly" configuration, while preserving the integrity of the microstrip interconnection.

Abstract: An optical package is disclosed which includes attachment means for reducing deflection of the optical signal path through the package wall upon attachment of the optical package to a relatively flat surface. In particular, a flange or other notched arrangement is utilized which both reduces and shifts the torque created in the wall containing the attached fiber as a force is applied to attach the package to the flat surface. In one embodiment, symmetric front-back attachment means are utilized to provide symmetry to the overall attachment arrangement.

Abstract: A multilayer ceramic package is disclosed which includes a high frequency interconnect that simulates the performance of a conventional coaxial connector. The interconnect comprises a signal conductor surrounded by the ceramic material forming the package. A plurality of vias are formed through the ceramic material so as to surround the conductor. These vias are then connected to a ground plane to form the outer shielding for the high frequency interconnect.

Abstract: A multilayer ceramic package for optical devices is disclosed for use in both high and low bit rate applications. A side portion of the multilayer package is formed to provide a multilayer microwave input connection for a high bit rate signal. In an exemplary arrangement, an intermediate ceramic layer of the multilayer structure is defined with an appropriate thickness and metallized on areas of the top and bottom surfaces. This combination thus forms a multilayer microwave connection defined as a microstrip. Other multilayer configurations, for example, a stripline, may also be used. By utilizing a multilayer microwave connection in place of a conventional electrical connection, the impedance of the high frequency input source can be better matched to the optical device.