Patents by Inventor Pam Montero

Pam Montero has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8508023
    Abstract: A semiconductor device has a substrate having a plurality of metal traces. A die is electrically attached to a first surface of the substrate. A first plurality of segmented metal traces is formed around a perimeter of the first surface of the substrate, wherein an end section of the first plurality of segmented metal traces is exposed. A mold compound is used for encapsulating the semiconductor device. A first metal plating is formed on a top terminal end section of the first plurality of segmented metal traces. The first metal plating is spread to at least one of the mold compound or the exposed end sections of the first plurality of segmented metal traces. A conductive coating is applied to the mold compound, the exposed end sections of the first plurality of segmented metal traces and to the first metal plating.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: August 13, 2013
    Assignee: Amkor Technology, Inc.
    Inventors: Michael G. Kelly, John Cambas, Francis Tan, Pam Montero