Patents by Inventor Pamela L. Miscikowski

Pamela L. Miscikowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via connector and method of making same
    Publication number: 20040020690
    Abstract: An insulator substrate or printed circuit board (PCB) having a filled and plated via. A sidewall of the via and preferably opposite sides of the insulator substrate are first plated with a conductive material. The plated via is then filled with an electrically conductive fill composition. A conductive cap layer is preferably formed over both ends of the conductive fill composition and the opposite surfaces of the insulator substrate, and can be bonded to a surface mount contact as a land or a pad.
    Type: Application
    Filed: July 28, 2003
    Publication date: February 5, 2004
    Inventors: John LeRoy Parker, Pamela L. Miscikowski
  • Via connector and method of making same
    Patent number: 6598291
    Abstract: An insulator substrate or printed circuit board (PCB) having a filled and plated via. A sidewall of the via and preferably opposite sides of the insulator substrate are first plated with a conductive material. The plated via is then filled with an electrically conductive fill composition. A conductive cap layer is preferably formed over both ends of the conductive fill composition and the opposite surfaces of the insulator substrate, and can be bonded to a surface mount contact as a land or a pad.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: July 29, 2003
    Assignee: Viasystems, Inc.
    Inventors: John L. Parker, Jr., Pamela L. Miscikowski
  • Via connector and method of making same
    Publication number: 20020043395
    Abstract: An insulator substrate or printed circuit board (PCB) having a filled and plated via. A sidewall of the via and preferably opposite sides of the insulator substrate are first plated with a conductive material. The plated via is then filled with an electrically conductive fill composition. A conductive cap layer is preferably formed over both ends of the conductive fill composition and the opposite surfaces of the insulator substrate, and can be bonded to a surface mount contact as a land or a pad.
    Type: Application
    Filed: April 23, 2001
    Publication date: April 18, 2002
    Inventors: John LeRoy Parker, Pamela L. Miscikowski
  • Via connector and method of making same
    Patent number: 6303881
    Abstract: An insulator substrate or printed circuit board (PCB) having a filled and plated via is provided. The plated via is filled with an electrically conductive fill composition. A conductive cap layer is formed on both ends of the conductive fill composition in the via and the major surfaces of the insulator substrate and can be bonded to a surface mount contact as a land or a pad.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: October 16, 2001
    Assignee: Viasystems, Inc.
    Inventors: John LeRoy Parker, Jr., Pamela L. Miscikowski