Patents by Inventor Pamela M. Klinkenberg

Pamela M. Klinkenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoplastic hot melt adhesive containing epoxy adduct
    Patent number: 5071914
    Abstract: The adhesive properties of a hot melt adhesive, comprising a base polymer and a tackifying resin, can be improved by introducing into the hot melt adhesive an epoxy adduct comprising the reaction product between a compound such as a polymer having at least one active hydrogen and an epoxy compound.
    Type: Grant
    Filed: August 17, 1989
    Date of Patent: December 10, 1991
    Assignee: H. B. Fuller Company
    Inventors: John M. Zimmel, Pamela M. Klinkenberg, William L. Bunnelle, Keith C. Knutson
  • Hot melt adhesives containing an additive derived from epoxy reactive hydrogen containing polymers and compounds and a polyepoxy compound
    Patent number: 4871803
    Abstract: The adhesive properties of a hot melt adhesive, comprising a base polymer and a tackifying resin, can be improved by introducing into the hot melt adhesive an epoxy adduct comprising the reaction product between a compound such as a polymer having at least one active hydrogen and an epoxy compound.
    Type: Grant
    Filed: February 3, 1988
    Date of Patent: October 3, 1989
    Assignee: H. B. Fuller
    Inventors: John M. Zimmel, Pamela M. Klinkenberg, William L. Bunnelle, Keith C. Knutson