Patents by Inventor Pan Kwon

Pan Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060261041
    Abstract: A chemical mechanical polishing (CMP) slurry for applying onto a complex structure consisting of two or more among a metal film, a nitride film and an oxide film and a method for manufacturing a metal line contact plug of a semiconductor device using the slurry. During a CMP process to form a metal line contact plug, an acidic CMP slurry having similar polishing speeds of metal films, oxide films and nitride films and not containing an oxidizer is used. As a result, a metal line contact plug can be easily separated using an acidic CMP slurry without any oxidizer.
    Type: Application
    Filed: July 28, 2006
    Publication date: November 23, 2006
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventors: Pan Kwon, Sang Lee